Rezonac has started Packaging Solution Center as new R&D center to propose one-stop solution for customers in 2018 and stablished the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment and substrates for 2.xD and 3D package in October, 2021. 2.xD and 3D packages require to connect chips and components in high density, therefore, both wiring pitch and vertical interconnect dimension must be finer and finer. At the same time, in order to achieve better performance, more and more chips are integrated together and thus the package size is increasing. To meet these requirement, we are developing fine vertical/lateral interconnect technology and the study of fabrication and reliability for the extremely large 2.5D advanced package. Regarding interconnect technology, we studied the micro-bump formation and bonding technology, the fluxless bonding process and encapsulation materials for filling narrow gaps. Specifically, we examined micro-bonding with a minimum 15 μm pitch, filling and encapsulation. Regarding lateral interconnect technology, we fabricated two categories of interposer, RDL-interposer with multi-layered Cu wirings and die embedded interposer, in 515x510 mm panel size applicable to socalled 2.xD semiconductor package. For the large package reliability, we fabricated 2.5D package using a 100 x 100 mm2 substrate. This package was then mounted on a printed circuit board, and reliability tests are underway to examine the effects of the constituent materials. The presentation will cover the significance and strengths of JOINT2, and updates on research and development.
