Senior Director, Electronics Business Headquarters
Resonac
Tokyo, Tokyo, Japan
Abe is leading R&D of semiconductor, substrate and display materials at Resonac.He was head of packaging solution center and launched JOINT2 in 2021.He was a general manager of CMP slurry business sector for 3 years, a manager of Marketing Promotion group in Innovation Promotion Center for 2 years, and a manager of business development group in packaging solution center for 1 year. He was a molding compounds engineer at Hitachi Chemical for 16 years.
He received a master degree in chemical engineering field from Tokyo institute of technology, Japan and a master degree at the EMBA course from Oxford, UK.
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Resonac’s Open Innovation at Advanced Package
Thursday, July 13, 2023
10:30 AM – 10:50 AM PDT