Power module package is driven by the ever increasing demand for high-efficiency power conversion, power-quality correction, renewable-energy systems, energy-storage systems, and electric vehicles. To enhance performance of power module packaging, development of chip technology is necessary, but the other components also play important supporting roles. This time we focus on the components other than chip for power module package such as epoxy encapsulation material, high thermal adhesive material, high reliability chip coating material, and high thermal sheet material. Big trend of power module are loading large current and high voltage for high-efficiency power conversion. As a result of this trend, junction temperature gets higher and higher due to corresponding huge amount of heat generated from the chip. Consequently the components within the power module are required to withstand large current, high voltage, and high temperature. Additionally, heat dissipation ability is also another important material requirement to enable thermal management. In this study we make clear the key properties of the material components to enhance electric reliability and show how we improve key properties of these materials. We would also like to present our total solution for thermal management of power module from the materials’ point of view. Contribution of these key material components other than the chip to enhance power module packaging trend are equally critically.