Koji Makihara

Manager
Sumitomo Bakelite Co., LTD. / Information & Telecommunication Materials Research Laboratory
Shinagawa-ku, Tokyo, Japan

Manager for R&D development group of Information & Telecommunication Materials Research Laboratory, Sumitomo Bakelite Co., LTD.
He works for development several packaging materials for semiconductor such as epoxy encapsulation material, high thermal adhesive material, high reliability chip coating material, and high thermal sheet material.

Disclosure information not submitted.

Presentation(s):

• The Latest material technology to support power module packaging

  Wednesday, July 12, 2023
  2:30 PM – 2:50 PM PDT