Fellow, Advanced Packaging
AMD
Austin, TX, United States
Deepak Kulkarni is a Fellow at AMD and currently manages the advanced packaging, technology integration team. Over the last seventeen years, he has held several leadership positions driving technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds fifteen patents and over twenty publications on various aspects of packaging such as 2.5D/3D architectures, DFM/DFY and AI techniques applied to yield management. His contributions to the semiconductor industry have been recognized by an Intel Achievement Award, Next 5% award (AMD) and best paper award (ITHERM). Deepak holds a PhD from the University of Illinois Urbana-Champaign with a major in mechanical engineering and a minor in computational science.
Disclosure information not submitted.
Enabling Moore's Law Through Heterogeneous Integration
Thursday, July 13, 2023
2:35 PM – 2:55 PM PDT