Fellow, Advanced Packaging AMD Austin, TX, United States
In the high-performance computing segment, we continue to see an explosion in demand for computing fueled by the proliferation of AI, 5G and edge computing. However, the slowing of Moore’s law has made it challenging to support this demand with traditional monolithic processors. Chiplet architecture provides a solution to meet the insatiable demand for compute. By creating custom, modular chiplets and integrating heterogeneous architectures on to one package the overall performance of the processor can be enhanced.
In this talk we discuss the latest innovations related to 3D packaging. We delve into the design and process co-optimization needed to achieve higher performance while controlling costs and power consumption. We will conclude our talk with a summary of opportunities and challenges that lie ahead