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Health of the Semiconductor Supply Chain: An Inside Look
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Juan Sarmiento, MBA – McKinsey & Company ### 2009415###Speaker###Expert ###McKinsey & Company###
Speaker: Juan Sarmiento, MBA – McKinsey & Company
### @@@ Henry Marcil – McKinsey & Company ### 2043340###Speaker###Associate Partner###McKinsey & Company###
Speaker: Henry Marcil – McKinsey & Company
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Heterogeneous Integration: HPC and Hyperscale Computing
Sponsor
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Heterogeneous Integration: HPC and Hyperscale Computing Panel Discussion/ Q&A from Audience:
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John Shalf, MS – Lawrence Berkeley National Laboratory / Applied Mathematics and Computational Science / Department of Energy ### 1675217###Panel Session Moderator###Department Head for Computer Science###Lawrence Berkeley National Laboratory / Applied Mathematics and Computational Science / Department of Energy###
Panel Session Moderator: John Shalf, MS – Lawrence Berkeley National Laboratory / Applied Mathematics and Computational Science / Department of Energy
### @@@ Mark Wade, PhD – Ayar Labs ### 2022430###Panelist###Chief Technology Officer, Co-Founder & Senior Vice President Engineering,###Ayar Labs###
Panelist: Mark Wade, PhD – Ayar Labs
### @@@ Richard Ho, PhD (he/him/his) – Lightmatter ### 2032474###Panelist###VP, Hardware Engineering###Lightmatter###
Panelist: Richard Ho, PhD (he/him/his) – Lightmatter
### he/him/his @@@ Bapi Vinnakota, PhD (he/him/his) – Open Compute Project Foundation ### 1718827###Panelist###OCP Open Domain-Specific Architecture Project Lead###Open Compute Project Foundation###
Panelist: Bapi Vinnakota, PhD (he/him/his) – Open Compute Project Foundation
### he/him/his @@@ Dereje Agonafer, PhD – UT Arlington ### 2022426###Panelist###Presidential Distinguished Professor###UT Arlington###
Panelist: Dereje Agonafer, PhD – UT Arlington
###
Heterogeneous Integration Paving the way for Microelectronics Resurgence
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William Chen, PhD (he/him/his) – Heterogeneous Integration Roadmap, IEEE EPS ### 1675215###Keynote Speaker###Chair###Heterogeneous Integration Roadmap, IEEE EPS###
Keynote Speaker: William Chen, PhD (he/him/his) – Heterogeneous Integration Roadmap, IEEE EPS
### he/him/his
Heterogeneous Integration Process Development and its Challenges
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Morgan Tribolet, BE – Intel ### 2003998###Speaker###Director in Wafer Level Assembly and Package Technology Development###Intel###
Speaker: Morgan Tribolet, BE – Intel
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High Performance Compute Devices and the Road to 2,000A
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Bob Bartlett – Advantest Corporation ### 1988459###Speaker###Director of Test Technology###Advantest Corporation###
Speaker: Bob Bartlett – Advantest Corporation
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Highly Conductive Transparent Electrodes Based on Embedded Metal-mesh and Applications
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Zheng Cui, PhD – Jiangsu Industrial Technology Research Institute ### 1961303###Speaker###Professor###Jiangsu Industrial Technology Research Institute###
Speaker: Zheng Cui, PhD – Jiangsu Industrial Technology Research Institute
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High-Temperature Microsupercapacitor Arrays Enabled by Printable Ionogel Electrolytes
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Lindsay E. Chaney – Northwestern University ### 2008647###Speaker###PhD Candidate###Northwestern University###
Speaker: Lindsay E. Chaney – Northwestern University
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Holistic Patterning to Enable Manufacturing for 2nm and Beyond
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Michael Lercel, PhD – ASML ### 1653396###Speaker###Senior Director Strategic Marketing###ASML###
Speaker: Michael Lercel, PhD – ASML
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How do we eat the PFAS elephant……
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Shekhar Chandrashekar, PhD (he/him/his) – inemi ### 2068667###Speaker###CEO###inemi###
Speaker: Shekhar Chandrashekar, PhD (he/him/his) – inemi
### he/him/his
How To Prepare for Unprecedented Growth and Risk in the Semiconductor Industry
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Michael Ciatto (he/him/his) – Genpact ### 1971133###Presenter###Senior Vice President | Supply Chain Service Line CEO###Genpact###
Presenter: Michael Ciatto (he/him/his) – Genpact
### he/him/his
How to Use AI for Sustainability to Win in the New ESG Economy
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Andrea Ruotolo, Fulbright PhD – Rockwell Automation ### 1971157###Speaker###Global Head, Customer Sustainability / ESG###Rockwell Automation###
Speaker: Andrea Ruotolo, Fulbright PhD – Rockwell Automation
### @@@ Warren Roos, PhD, PE – Rockwell Automation ### 2057278###Speaker###Global Technical Lead - Customer Sustainability###Rockwell Automation###
Speaker: Warren Roos, PhD, PE – Rockwell Automation
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HTU 2.0
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Human motion detection utilizing strain and electromyography signals attached to a non-joint area
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Hayun Kim – Seoul National University ### 2008644###Speaker###stretchable electronics###Seoul National University###
Speaker: Hayun Kim – Seoul National University
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HVM test of UCIe-enabled chiplets for 2.5D and 3D devices: The case for a dedicated test port
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Michael Braun (he/him/his) – Advantest Europe GmbH ### 1988456###Speaker###Product Marketing Manager###Advantest Europe GmbH###
Speaker: Michael Braun (he/him/his) – Advantest Europe GmbH
### he/him/his