Additive manufacturing will be a key component in advanced semiconductor packaging. A key material will be the use of conductive inks that will be complementary to conventional metallization techniques including PVD and plating. At Electroninks, we have developed conductive inks based on metal complex technology, and the only global supplier of metal-complex based Ag, Cu, Ni, Pt, Pd, Au conductive inks, as well as dielectric and resistor inks. PVD is currently the most commonly used method to apply for wafer metallization (BSM) and it requires a complex, multi-step process. We will review a different approach to wafer metallization which includes different printing techniques such as inkjet printing, aerosol jet printing and spray coating for wafer metallization. We will also review film uniformity, adhesion and reliability and a cost model which compares spray coating with Physical Vapor Deposition (PVD) which factors in both CAPEX and UPH.
