Endless possibilities are enabled by scaled, domestically manufactured roll-to-roll flexible hybrid electronics. The process begins with identifying the right partner. The fabrication of printed and flexible hybrid electronics (FHE) circuits, sensors and IOT devices involves the need for both expertise and capabilities that cross over a number of unique manufacturing areas. These including functional printing and converting technologies, advanced materials knowledge, electronics and circuit design skills, knowledgeable encapsulation capabilities and more. Perhaps even more important is the need for a partner who invests the time to really listen and embrace the vision of the product manager and the end goal that the solution is attempting to solve for. Attention to the detail, good communication and collaborative problem solving are the things that help move commercialization efforts from early POC concepts and TRL/MRL levels through to full scale R2R manufacturing. Building smart products that encompass printed electronics, traditional IC, high performance flexible substrates and elegant form factors that are intuitive, responsive and dependable is what we do at Tapecon. Let's build something great!.
