To meet accelerated development and NPI (new product introduction) cycles, integration of all fabrication steps — foundries, OSATs (outsourced semiconductor assembly and test), E2MS (electronic engineering manufacturing services), FATP (final assembly, test, and pack) — must work in unison. It is no longer optional to work independently and move material from one sector or industry to another. This approach slows ODMs' (original design manufacturers) time-to-market (TTM) and limits their ability to capture total available market (TAM) or be the first to create a new market. Smart manufacturing and agile project management (PM) approaches have become mainstream paths to expediting TTM, replacing a traditional manufacturing and waterfall PM “in sequence” methodology. The benefits of smart manufacturing go beyond the production floor and can enhance entire order fulfillment solutions. The goal of this presentation is to introduce the importance of driving product/process development in a collaborative manner. It will include an introduction to smart manufacturing (examining what smart manufacturing is and how it is applied today), an overview of a digital product lifecycle management (PLM), and a case study for a manufacturing/assembly of a standalone subassembly. The case study will focus on foundries (wafer-level), OSATs, and an E2MS smart manufacturing approach to an integrated solution on non-traditional substrates (i.e., a miniature standalone optical module) emphasizing the benefits of incorporating bare-die (wafer-level) and optics onto mechanical packaging (chassis and cover) and system test.