Abstract or Demonstration Description: The demand for semiconductor devices continues to increase at an unrelenting pace. Integrated circuits are in more and more of the products and services we use and interact with in our everyday lives. One segment of particular interest is the automotive semiconductor market. Semiconductor device content is increasing from an average of $400 per standard automobile to over $1,100 for battery electrified vehicles. This increase in the semiconductor content causes additional pressure on the semiconductor suppliers to further reduce device costs. One approach to reducing the device costs is to reduce the cost of test of the devices. In order to reduce the cost of test for automotive devices, Infineon worked with FormFactor to implement the production proven TrueScale Matrix platform for the V9300 direct dock tester. The TrueScale Matrix product had previously been deployed into production on traditional round PCBA tester configurations. Working together, the initial configuration was developed in a rectangular probe head configuration providing an active area to 200mm by 300mm resulting in a significant increase in the probe card parallelism and reducing the overall cost of test. An additional enhancement to the probe card architecture enabled a 300mm full wafer contactor solution to further increase the parallelism and test efficiency. This presentation will review the results of the collaboration between Infineon and FromFactor to implement the high parallelism TrueScale Matrix product solution on V93000 direct dock tester systems. In addition, superior thermal mechanical design of the probe card provides a capability to use same probe card over wide temperature range from -40oC to 150oC. We will also share extensive engineering characterization results on prober deflection and thermal behavior, high pin count probe card AOT vs. POT and the low force MEMS probes on wafer pad to achieve stable contact over the large probing array with minimal impact to the test pad.