IDS’ novel, patented approach to aerosol printing has found very good acceptance around the world in multiple market segments and applications. The unique method for in-situ aerosol generation, minimizing transport distance and dual focusing lenses is delivering performance that is making aerosol printing ready for production. IDS will be introducing its next generation aerosol printing with a focus towards semiconductor packaging applications. Aerosol technology has the potential to add significant value to several areas related to semiconductor packaging. The talk will first introduce IDS’ aerosol technology and provide print performance data including process stability, duration testing results, results including for duration testing using several inks. The talk will include details regarding the recently developed high speed shuttering that enables rapid printing of bumps in semiconductor applications. Details for shuttering speed, print latency, etc. will be discussed. Recent developments related to direct write Au bumps, printing of micro-antenna, aerosol wire bond replacement will be discussed including detailed analysis of printed features.