Flexible hybrid microelectronics systems are being introduced for wearables, implants, drug delivery, human-machine interfaces, rapid diagnostics and more. These novel medical devices rely on leading-edge thin and flexible microelectronics. Flexible microelectronics provide the necessary physical form factors to enable these new capabilities, but are they reliable? Answering this question requires an evolution in electronics system testing that accommodation for devices that are designed to conform, bend and even stretch during use. These are new requirements that are not typical of standard microelectronic systems. Development of test methods and robotic test systems to assess reliability in systems that bend and stretch is rapidly evolving. Most recently, American Semiconductor a pioneer in flexible hybrid electronics reliability, and Bayflex/YUASA the leader in robotic test systems for flexible materials, have collaborated to establish advanced reliability test and characterization capability for flexible hybrid systems. This presentation provides an update on advances in test methods, test systems and recent data for reliability performance of flexible hybrid systems for medical device applications.