The work will address the topic of hybrid integration of multiple devices stemming from multiple technologies and with different interfaces. The concept of a base Si platform, the holder, will be discussed in terms of its thermal, electrical, mechanical stability and characteristics. This structure, developed using high precision micro-fabrication techniques, is the base for complementing the limitations of several off the shelf technologies regarding its interfacing for planar integration. The challenge of high precision alignment stemming from the low mode field inside the photonic chips and its connection to the optical fibre is going to be addressed by presenting tools and unique techniques that may help overcoming the large tolerances of dicing and wafer polishing. On the other end, this same platform is also a good host for the different drivers and amplifiers required to control the optical devices, as its unique metallization layout allows for their electrical connection and reaching large bandwidths. The thickness of these latter devices usually differs from the ones of the photonics devices and therefore specific pockets and techniques must be applied to minimise bonding related problems. In this work we will address the described problems and show the results of a use case in the field of optical access networks.
