Flip-chip die and die-to-die bonding typically require solder balls and underfills. Underfill and/or edge encapsulant is often utilized to provide mechanical strength and stress reduction. The result is a complex assembly process flow and rigid interconnect. Localized placement of ACA or ACF for specific components typically involves use of thermocompression bonding, an additional process step that's potentially damaging to thin silicon. furthermore, traditional interconnect materials are relatively slow to process, limiting their utility. Development towards a manufacturing scalable packaging method will be shared, using a pressure-less and low temperature magnetically aligned Anisotropic Conductive Epoxy (ACE). The basis of which is formation of magnetically aligned Z-axis ferromagnetic particles within an epoxy. In this method these Z-axis columns are fixed in place during the die-to-substrate curing using a magnetic field (magnetic pallet), without pressure. This simplifies the assembly process to a single adhesive application, providing both electrical interconnection and mechanical reinforcement. No underfill is used. Fine patterning is not required as the entire area of the component's location is deposited with epoxy. Device alignment is more forgiving without the criticality of solder ball-to-pad alignment. Z-axis columns align after component placement, magnetic pallet exposure and cure is achieved. Processing temperatures can range from 80°C to 160°C, broadening applications for substrates and biocompatible assemblies. The ACE isn't limited to specific device attachment; it can be used to bond multiple component sizes and styles. This talk follows developments and examples of fine pitch die-to-die bonding with magnetically aligned ACE, using an optimized formulations to enable finer pitches and more challenging alignments. Process advancements made for die-to-die bonding and updates on achieving ≤ 60-micron pitch with uniform bond lines for optimum electrical performance. Dense arrays of 60 microns pitch die, 30 microns pads and 30 microns spacing, were used. Electrical performance results of continuity, resistance, and pad-to-pad variation were studied and used to iterate and optimize process. Robustness was measured for mechanical strength by shear testing and thermal stress. The material and process advancements of this work are relevant to heterogenous packaging, high density fine pitch interconnects, and applications requiring more flexibility than traditional rigid bonds.