X-FAB is one of the world’s leading specialty foundry groups for analog/mixed-signal semiconductor technologies with more than thirty years of experience in volume manufacturing and a clear focus on automotive, industrial, and medical applications. In this paper we present a new technological approach to create ultra-thin chiplets down to below 10 µm and ready for implementation into flexible electronics devices. Micro-Transfer Printing – a wafer-scale mass transfer process with highest placement accuracy (3σ < 1.5µm) – enables heterogeneous flexible systems by multi-chip embedding and compatible interconnects (re-distribution layers, RDL). We present advances in creating “print-ready” chiplets based on processing of analog/mixed-signal ASICs and sensors, using X-FAB’s 180nm BCD-on-SOI Platform in combination with MEMS post-processing. The chosen technological approach has been proven to be applicable to other types of chiplets such as compound semiconductors. Wafer-scale processing renders this integration technology compatible with well-established semiconductor manufacturing techniques and quality standards. The presented technology platform is fully scalable from prototypes to mass production and benefits from the circuit design environment and universality of analog/mixed-signal ASIC technology – enabling a large variety of application. Small-scale chiplets enable high packing density in miniaturized systems as well as extreme substrate curvature radii. If used in combination with bio-compatible materials, this technological approach is highly suitable for implantable devices, in-vivo diagnostics and others.