Chair
Heterogeneous Integration Roadmap, IEEE EPS
Sunnyvale, CA, United States
William Chen (Bill) holds the position of ASE Fellow & Senior Technical Advisor at ASE Group. Prior to joining the ASE, he was the Director at the Institute of Materials Research & Engineering (IMRE) in Singapore, following a distinguished career at IBM Corporation. He was a past President of the IEEE Electronics Packaging Society. He has been elected a Fellow of IEEE and a Fellow of ASME. He received the IEEE Electronics Packaging Field Award for contribution to electronic packaging from research & development through industrialization. He chairs the Heterogeneous Integration Roadmap initiative.
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Session Welcome Remarks and Agenda review
Wednesday, July 12, 2023
2:00 PM – 2:10 PM PDT
Wednesday, July 12, 2023
4:40 PM – 5:00 PM PDT
Heterogeneous Integration Paving the way for Microelectronics Resurgence
Thursday, July 13, 2023
9:10 AM – 9:55 AM PDT