Ph.D. Candidate
University of California, Los Angeles
Reseda, CA, United States
Randall Irwin received the B.S. degree in electrical engineering from the University of California, Los Angeles (UCLA) in 2019. He is currently a Ph.D. candidate in the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS) in the department of electrical and computer engineering. He has been a Student Researcher at UCLA CHIPS since 2017 where he has researched flexible electronic packaging, enabling technologies for systems-on-wafer, thermally conductive elastomers, and heterogeneous integration.
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Effect of Flexion on Performance of a High Bandwidth Flexible Connector with Low-Loss Dielectric
FLEX Conference: Student Poster Session