Graduate Student
University of Washington
Seattle, WA, United States
Henry Lei is a graduate student pursuing his PhD at the University of Washington, Seattle, WA, in the Material Science and Engineering department, supervised by Prof. Devin MacKenzie. His research interest includes high density and high frequency capable interconnects via additive manufacturing techniques on flexible substrates. He is also currently an ASIC designer with NoiseFigure Research, Renton, WA.
Disclosure information not submitted.
Additive Manufacturing of Flexible Rectenna
FLEX Conference: Student Poster Session