The Komori presentation will highlight the precision of printing traces using gravure offset equipment along with the versatility inherent in the system regarding substrates, pastes and purpose. Substrate flexibility includes, but is not limited to, flexible films, rigid material, and wafers. Versatility in pastes, to date, include conductive flake, nanoparticle paste, flux, solder paste, solder resist and etching resist. Applications benefiting from gravure offset range from trace printing, fanout pattens, “bump” printing of ink or flux (ex. terminal points), along with applying those flux bumps directly onto the microchips while they are still part of the wafer and printing the micro-LED connections. Circuits or printed components developed using offset gravure can move seamlessly into production with a very low cost per piece due to the nature of the gravure offset process.
