Realtime Deep Data Adaptive Testing for Die-to-Die Interfaces

Heterogeneous packaged devices at manufacturing test are faced with quality and reliability challenges due to the lack of accessibility and visibility of traditional test approaches.  Dies are assembled over a silicon interposer using very small micro-bumps which may suffer from marginal or latent defects such as voids or cracks, potentially posing a reliability risk to the assembled product. On organic substrates, resistive shorts, known as bridging shorts, can cause signal integrity issues and performance degradation. These types of defects, although rare, could cause a system failure over time if not screened out during final test or detected during in-field operation.

To address these challenges, proteanTecs and Advantest have deployed a joint solution for die-to-die (D2D) interface testing.  proteanTecs provides a monitoring solution for heterogeneous packaged devices based on chip telemetry, combining deep data with machine learning (ML) algorithms.  proteanTecs’ patent-protected solution is comprised of small-footprint, digital-only agents for monitoring the performance of the parallel interface. These agents (monitoring IP) are designed for analytics. The fact that they have a low area requirements allows them to be placed next to each pin inside the parallel D2D PHY, to achieve 100% coverage and with no impact on the signal behavior, quality, or timing.  proteanTecs’ SW analytics platform then trains models that are deployed at test or in the field. 

To achieve the highest levels of performance, proteanTecs has partnered with Advantest on the ACS Real-Time Data Infrastructure (RTDI) for real-time decision-making.   ACS RTDI is comprised of the ACS EdgeTM high-performance and highly secure edge compute appliance, ACS NexusTM real-time data communications and control software, and ACS Container HubTM and ACS Unified ServerTM for secure and reliable deployment of advanced analytics into test cells. proteanTecs’ advanced analytics work in conjunction with ACS RTDI to enable fast, precise, and thorough testing of D2D interfaces in today’s most complex heterogeneous packaged products while at the same time optimizing test costs.

In this poster, we will provide details for the integrated solution and silicon results.  We will highlight how the solution provides new levels of visibility for real-time adaptive testing.