Panel Discussion: From Assembly Line to Field: The Future Semiconductor Testing

The world’s growing reliance upon semiconductor devices has fostered the need to perform tests from cradle to grave. Fundamentally a test measures a parameter of interest. The traditional manufacturing screen performed at "time zero" is no longer sufficient because there exists benefits to tracking how a parameter changes over time. Now end users want tests to add value throughout a product's entire lifetime.

To fully embody this value the test community must reassess areas for improving test measurement collection. Thus, this panel discussion explores the critical areas that need to be rethought to ensure that testing adds value throughout a product's lifespan and provides value to all participants in the supply chain. These critical areas include examining the adequacy of existing test standards, business barriers to leveraging data siloed across the supply chain, and making the most of internal circuits for test measurements.

Finally, the plan will discuss the critical industry problems that are driving innovation in semiconductor device testing. By understanding these challenges, we can identify new opportunities for collaboration and drive progress in the field.