Business Development DIrector EV Group St. Florian am Inn, Austria
MEMS and sensors are a key technology for many of today´s applications and must meet the highest standards of performance and reliability. Many emerging applications also need to combine different disciplines such as photonics, biomedical and nanotechnology at the device-level, pushing the demands even further. To cope with the higher system complexity and still reduce footprint, power consumption and cost, wafer-level processing is the most efficient integration method. Wafer bonding, for example, is one of the key technologies driving advances in system integration. Digital lithography is another example that enables completely new design possibilities for MEMS devices and at the same time is able to compensate increasing manufacturing challenges which arise from a higher material mix and more complex designs. This presentation will discuss the requirements and capabilities of such semiconductor processing solutions for next generation sensor devices.