Future electronics will need to enable electrical functionality coupled into complex formfactors to enable the electromechanical solutions of tomorrow. This field to enable electronics functionality into 3D applications is known as flexible hybrid electronics (FHE). The FHE process entails fabricating electronic functionality onto flexible 2D substrates and conforming the flexible substrate onto the 3D form factor. This process may require bending and stretching of the circuit elements to appropriately conform to the desired structure. As design complexity increases the application of the flexible substrate becomes more difficult. A method to circumnavigate this issue is highlighted in this work. Here we present multi jet fusion (MJF) 3D printed electronics’ (3DPE) capabilities towards FHE. MJF 3DPE uses a conductive agent applied to specific voxel (volumetric pixel)-scale regions of a geometry to create conductive properties within the 3D part enabling printed conductive traces, vias, and pads anywhere within or on a part’s 3D geometry. This enables the construction of a 3D geometry that conforms to the shape and function intended by the designer and delivers the needs that the traditional FHE has been fulfilling. Within this work, we will present a wholistic approach to designing, modeling, fabricating, and validating MJF 3DPE to enable smart devices. After fabrication of the MJF 3DPE device, traditional Pick and Place (P&P) were used for component attachment thus enabling the desired FHE functionality. Post-Processes techniques like aerosol jet printing (AJP) were also used to create features with finer resolutions than the current MJF 3DPE process. Additionally, Digital Twin technology was leveraged by appropriately collecting process and part data to enhance part and trace quality, predictability, and consistency of manufacturing output. To further enhance the understanding of the MJF 3DPE process towards FHE applications, a discrete element methods (DEM) model was constructed to understand the interplay between the polymer melt and conductive agent sinter process. Finally, we utilized internal geometry investigation techniques like x-ray tomography to characterize the internal MJF 3DPE trace structure and correlate to the DEM model predictions.