Direct-Write printing enables the selective deposition and patterning of dielectric and conductive materials in a multi-layer fashion to create high-resolution 3D circuit elements. However, issues with micro-sized feature dimensional control and print consistency has impeded its integration into mainstream RF electronics. Our objective is to use Aerosol-Jet (AJ) deposition of conductor and dielectric materials to print impedance controlled interconnections to silicon die bond pads. Using printed die connections in place of conventional wire bonding has measurable advantages in terms of lower transmission loss at millimeter wave (mmW) frequencies. In addition, printed connections do not need the manual wire tuning required for wire bonds and printed connections are more robust and reliable. An embedded PIN diode limiter circuit was demonstrated as an example of a mmW RF circuit element with AJ printed interconnections. A hybrid fabrication approach was chosen using conventional low-K substrates and etched copper foil to create a coplanar waveguide transmission line with the active die embedded in the substrate. PIN diode printed elements were placed in the circuit where there was a realizable size reduction and performance advantage. DC Resistance, Return Loss (S11) and Insertion Loss (S21) were measured and compared to wire bonded samples up to 40 GHz frequency with thermal cycle testing conducted to prove reliability. This work will help gain acceptance of printed electronics into fielded hardware for high-frequency RF applications.