Metal Complex Inks and Films for Additive Manufacturing

Abstract
The goal of utilizing conductive inks to augment or compliment traditional metallization approaches in semiconductor packaging applications is to enable ultimate design, functionality, and capital expenditures (CAPEX) flexibility through additive manufacturing, without sacrificing on performance and reliability. Traditional metallization processes include the sputtering method, which is a Physical Vapor Deposition process (PVD), and plating, among others. The metal films and patterns are required for electromagnetic interference (EMI) shielding, interconnects, thermal management, power delivery and wafer metallization. These processes have certain limitations related to technology factors (limits on panel area, uniform thickness on complex 3D shapes, temperature, and patterning), as well as economic factors (throughput, CAPEX, footprint, and energy usage). Alternatively, the technology is seeing a shift to jettable (aerosol and inkjet) or sprayable conductive-based ink for conformal shielding and additive, 3D metallization. This approach brings about substantial total cost of ownership and throughput/Unites per Hour (UPH) advantages that will be reviewed in this talk, as the ink-based processes (spray/jet) does not require vacuum, and relatively low temperatures (at or below 180C in most cases). At Electroninks, we have created a line of metal-complex conductive inks for the semiconductor packaging industry. The conductive inks can be printed via various digital printing techniques such as aerosol jet printing, inkjet printing, and spray coating. The inks can be jetted or sprayed on 3D packages, wafers, chips, boards, and housings to provide a high-performance shielding layer that is reasonably priced and has outstanding REL qualities.
In this presentation, we will review different printing techniques such as aerosol jet printing, inkjet printing and spray coating. These printing techniques can be used for wafer metallization, antenna on package (AOP) and large area coating. We will also review 5-sided shielding via spray coating, film performance parameters including coating thickness uniformity, EMI shielding effectiveness, adhesion, and process parameters.
A cost model in comparison to Physical Vapor Deposition (PVD) that factors in both CAPEX and UPH will be presented. We will discuss the increase in throughput by reducing the spacing between packages and using multiple head printing technology. Finally, to better support clients around the world, we will briefly describe the customer adoption cycle as well as our commercial and partner ecosystem.