The development of 5G millimeter-wave technology is paving the way for the next generation of high-speed wireless communications. The main requirements for components and models designed for future system on package (SoP) integration are reliable performance within broad operational bandwidth, low parasitic losses at mm-Wave frequencies, and high volumetric utilization so that more functionalities can be packed into a compact module. This presentation will introduce the characterization, evaluation, and implementation of fully additively manufactured flexible “smart” packaging and reconfigurable on-package antenna arrays for next generation 5G/mmW SoP designs for wearable/flying/portable platforms. 3D printed flexible materials were first characterized for their electrical and mechanical properties over 24-40GHz, covering the entire range of 5G mmWave bands, and Polypropylene was identified with a very low loss tangent of 0.001. The inkjet printed interconnects on PP substrates demonstrated good electrical and mechanical performance with less than 0.1dB/mm insertion loss during a 10,000-time cyclic bending test over a 1-inch bending radius. Finally, an inkjet printed reconfigurable phased array with an integrated microfluidic cooling channel on 3D printed substrates was designed, fabricated and measured as proof-of-concept demonstration, achieving 10.09dBi maximum realized gain and ±37° beam steering range with efficient cooling from 108°F to 98°F in 5min. The developed technology presents a comprehensive approach to improving the efficiency and functionality of flexible wireless modules for wearable wireless applications. The final results of this work have demonstrated a fully functioning 5G/mmW wearable and flexible reconfigurable antenna array front end for high-data application ranging from next generation consumer hardware to military applications for advanced real-time high speed uplinks. During the investigation, challenges in inkjet printing onto 3D printed substrates, reliability of inkjet printed interconnects, and assembly of beamformer IC onto flexible substrates have been successfully addressed. The paper will also discuss the challenges in heterogeneous integration of “smart packaging” that are critical for future extension to more complex “self-monitoring” modules and much higher frequencies to satisfy high-capacity demand in the next stage and enable future integration of multiple fully printed sensors and multi-microfluidic structures in 5G+/6G sub-THz freqs large area and metasurface/digital twin/Industry 4.0 applications.