Entegris leads the way in the design and manufacturing of dedicated SiC consumables, including CMP slurries, post CMP cleans, and pads. Our products are meticulously engineered for high-volume production, catering to the growing demand in the industry. Our versatile products can be utilized across a wide range of new and existing OEM tools, such as single, double, and batch polishing equipment. By incorporating our slurries, these tools experience improved thruput efficiencies while simultaneously reducing wafer level defects and scratches. Post CMP cleaning of wafers is of utmost importance, ensuring the removal of particles and metal contaminants before the epitaxial process. Our post CMP cleans are specifically developed to address this challenge while maintaining the performance of CMP pads and tool sets through effective cleaning solutions. Lastly, Entegris possesses cutting-edge cleanroom facilities, enabling us to conduct in-depth studies, analysis, and testing of pad/slurry interactions. This capability allows us to develop next-generation slurries and cleans, particularly as the industry transitions from 6" to 8" wafer sizes. The focus of this presentation is to showcase compelling data on the performance of Entegris' SiC consumables across various toolsets, addressing both current and future industry requirements.