Processing & Integration

Thursday, July 13, 2023

1:30 PM – 2:50 PM PDT

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Session Chair(s)

Clinton Braganza, PhD

Research and Development Manager, Principal Scientist
Kent Displays
Kent, OH, United States

1:30 PM – 1:50 PM PDT

Highly Conductive Transparent Electrodes Based on Embedded Metal-mesh and Applications
Speaker: Zheng Cui, PhD – Jiangsu Industrial Technology Research Institute
1:50 PM – 2:10 PM PDT

Modular microcontrollers for rapidly configurable IOT devices
Speaker: Jeff Bergman, MSE – NextFlex
2:10 PM – 2:30 PM PDT

Non-contact Capacitive Coupling-based EMG Sensing System for Smart Armband Applications
Speaker: Heng-Yin Chen, phD – Industrial Technology Research Institute
2:30 PM – 2:50 PM PDT

Flexible Hybrid Electronics Sensors for Product Quality Monitoring and Logistics Applications
Speaker: Shizuo Tokito, PhD – Yamagata University