Hybrid Electronics & Advanced Packaging

Session Chair(s)

• 

  António Teixeira, PhD

  Chief of Strategy and Technology Officer (CSTO)
  PICadvanced
  Ilhavo, Aveiro, Portugal

Presentations:

• 1:30 PM – 1:50 PM PDT

  Die-to-Wafer Hybrid Bonding to address Next-Gen Electronics Packaging Challenges
  

  Speaker: Avi Shantaram, MS, MBA – Applied Materials
• 1:50 PM – 2:10 PM PDT

  Stretchable Thermoelectric Generators and Peltier Coolers for Wearable Applications
  

  Speaker: Mason Zadan – Carnegie Mellon University
• 2:10 PM – 2:30 PM PDT

  Ultra-thin Chiplet Integration for small-scale flexible Devices by Micro-Transfer Printing
  

  Speaker: Stefan Ernst, PhD – X-FAB MEMS Foundry
• 2:30 PM – 2:50 PM PDT

  Advanced Hybrid Printing Processes for Complex Metal Dielectric Structures via Three-Axis Systems
  

  Speaker: Gilbert T. Carranza – The University of Texas at El Paso