Automotive is one of the fastest growing segments of the semiconductor market. An electric vehicle (EV) with an SAE Level 2 advanced driver-assistance system (ADAS) has four times the semiconductor content of an average gasoline-powered vehicle. For electronic products, a semiconductor or an integrated circuit (IC) package serves the critical functions of protecting and interconnecting the semiconductor chip. These are the same functions the package performs in automotive applications as well, but with different and more difficult challenges.
Driven by the rise of ADAS, infotainment and EVs, IC packaging used in automotive applications is changing from traditional form factors. Additionally, as automotive application profiles change, reliability requirements are becoming more challenging. This presentation will explain trends in automotive semiconductor packaging and discuss the latest challenges and solutions for ADAS, infotainment and EV semiconductor packaging.
