Full Schedule

8:30 AM – 8:40 AM PDT

CEO Summit: Path for Talent Welcome Remarks

Location: Keynote Stage, Room 24, North Lower Lobby

Speaker: – SEMI

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8:40 AM – 8:45 AM PDT

CEO Summit: Path for Talent Opening Remarks

Location: Keynote Stage, Room 24, North Lower Lobby

Speaker: – SEMI Foundation

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8:45 AM – 9:15 AM PDT

Keynote: One Trillion Reasons to Join our Industry

Location: Keynote Stage, Room 24, North Lower Lobby

Keynote Speaker: – Axcelis Technologies

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9:15 AM – 9:45 AM PDT

Keynote: Building the Future: Workforce Development in the Semiconductor Manufacturing Industry

Location: Keynote Stage, Room 24, North Lower Lobby

Keynote Speaker: – SkyWater Technology

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9:45 AM – 10:15 AM PDT

Keynote: Transforming Pathways To Transformative Semiconductor Careers

Location: Keynote Stage, Room 24, North Lower Lobby

Keynote Speaker: – University of California, Berkeley

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10:15 AM – 10:20 AM PDT

Announcement of 20 Under 30 Award Recipients

Location: Keynote Stage, Room 24, North Lower Lobby

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10:20 AM – 10:30 AM PDT

Presentation of the SEMI Foundation Excellence in Achievement Award by EMD Electronics

Location: Keynote Stage, Room 24, North Lower Lobby

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10:30 AM – 11:30 AM PDT

"Chip In"– Roadtrip Nation Panel

Location: Keynote Stage, Room 24, North Lower Lobby

Speaker: – Roadtrip Nation

Panel Session Moderator: – SEMI Foundation

Panelist: – University of Texas Austin

Panelist: – Accenture

Panelist: – Aeris LLC

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8:30 AM – 8:45 AM PDT

Welcome Remarks and Symposium Overview

Location: Moscone North, Exhibition Level, Room 20

Session Moderator: – Soitec

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8:45 AM – 9:15 AM PDT

SOI Market Trends and Potential Applications

Location: Moscone North, Exhibition Level, Room 20

Speaker: – Yole Group

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9:15 AM – 9:45 AM PDT

SOI for Markets that Matter

Location: Moscone North, Exhibition Level, Room 20

Speaker: – GlobalFoundries

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9:45 AM – 10:15 AM PDT

Engineered Substrates for Best PPAC: SOI chapter

Location: Moscone North, Exhibition Level, Room 20

Speaker: – Soitec

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10:35 AM – 10:55 AM PDT

It takes an ecosystem to enable a process

Location: Moscone North, Exhibition Level, Room 20

Speaker: – Synopsys

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10:55 AM – 11:15 AM PDT

Future Needs and Solutions

Location: Moscone North, Exhibition Level, Room 20

Speaker: – CEA-Leti

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11:15 AM – 11:35 AM PDT

RF-SOI for SATCOM, 5G and 6G: The Ideal Process

Location: Moscone North, Exhibition Level, Room 20

Speaker: – UCSD

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11:35 AM – 12:00 PM PDT

Characterization Challenges for Future RF Materials

Location: Moscone North, Exhibition Level, Room 20

Speaker: – Incize

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1:30 PM – 2:00 PM PDT

FDSOI for Automotive Processors: The i.MX8 Family

Location: Moscone North, Exhibition Level, Room 20

Speaker: – NXP Semiconductors

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2:00 PM – 2:20 PM PDT

28nm FDSOI Stellar MCUs: More Performance, Less Energy Toward a Sustainable Future

Location: Moscone North, Exhibition Level, Room 20

Speaker: – STMicroelectronics

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2:40 PM – 3:00 PM PDT

FDSOI Adaptive and Versatile IoT Node for Energy Efficient Local AI Processing

Location: Moscone North, Exhibition Level, Room 20

Speaker: – CEA-Leti-LIST

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3:00 PM – 3:20 PM PDT

Enabling Power Efficient Design Using Synopsys Foundation IP for GlobalFoundries 22FDX® & 22FDX+™ Processes

Location: Moscone North, Exhibition Level, Room 20

Speaker: – Synopsys

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3:20 PM – 3:40 PM PDT

Dolphin Design: ABB Solution to Optimize the Magic of SOI Technologies

Location: Moscone North, Exhibition Level, Room 20

Speaker: – Dolphin Design

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3:40 PM – 4:00 PM PDT

Advanced SOI Radar Sensors for Human Motion Detection

Location: Moscone North, Exhibition Level, Room 20

Speaker: – GlobalFoundries

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9:00 AM – 9:05 AM PDT

Opening Remarks

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – Teradyne

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9:10 AM – 9:55 AM PDT

Heterogeneous Integration Paving the way for Microelectronics Resurgence

Location: Moscone South, Exhibition Level Room 9

Keynote Speaker: – Heterogeneous Integration Roadmap, IEEE EPS

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9:55 AM – 10:00 AM PDT

Session III: Introduction

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – Advantest America Inc.

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10:00 AM – 10:25 AM PDT

Production Test RF Calibration Methods for Probe Cards

Location: Moscone South, Exhibition Level Room 9

Speaker: – FormFactor

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10:25 AM – 10:50 AM PDT

ATE Latch-up Testing of Real World, High Power Devices

Location: Moscone South, Exhibition Level Room 9

Speaker: – ISE Labs, Inc.

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10:50 AM – 11:15 AM PDT

Getting the Straight Story: Approaches to Linearity Measurements for ADCs

Location: Moscone South, Exhibition Level Room 9

Speaker: – National Instruments

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11:40 AM – 12:05 PM PDT

Emerging PMIC Trends Demand Test Innovations

Location: Moscone South, Exhibition Level Room 9

Speaker: – Teradyne

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12:05 PM – 12:30 PM PDT

Test Vision - Program Chair Remarks

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – Advantest

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1:00 PM – 1:55 PM PDT

CHIPS Act Implementation: Past, Present, and Future - mySilicon Compass

Location: Moscone South, Exhibition Level Room 9

Keynote Speaker: – mySilicon Compass

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1:55 PM – 2:00 PM PDT

Session IV: Introduction

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – AEM

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2:00 PM – 2:25 PM PDT

HVM test of UCIe-enabled chiplets for 2.5D and 3D devices: The case for a dedicated test port

Location: Moscone South, Exhibition Level Room 9

Speaker: – Advantest Europe GmbH

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2:25 PM – 2:50 PM PDT

Advancing Probe Card Parallelism for SOC Devices

Location: Moscone South, Exhibition Level Room 9

Speaker: – FormFactor

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2:50 PM – 3:15 PM PDT

Mixed-Signal Test Workforce Development - An analysis of the Test Program at Texas A&M University

Location: Moscone South, Exhibition Level Room 9

Speaker: – Texas A&M University

Speaker: – Texas A & M

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3:15 PM – 3:40 PM PDT

Enabling Comprehensive, ATE Class, High-performance Protocol Validation on the Bench

Location: Moscone South, Exhibition Level Room 9

Speaker: – Soliton Technologies Private Limited

Speaker: – Soliton Technologies

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3:40 PM – 4:50 PM PDT

Panel Discussion: From Assembly Line to Field: The Future Semiconductor Testing

Location: Moscone South, Exhibition Level Room 9

Panel Session Moderator: – semiengineering.com

Panelist: – Archon Design Solutions, Inc.

Panelist: – Intel

Panelist: – PDF Solutions

Panelist: – proteanTecs

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4:50 PM – 4:55 PM PDT

Symposium Raffle and Winner Announcement

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – Advantest America

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4:55 PM – 5:00 PM PDT

Closing Remarks

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – Teradyne

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10:30 AM – 10:40 AM PDT

Aerosol Printing for Vertical Interconnects and Non-Planar Printing

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – IDS

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10:45 AM – 10:55 AM PDT

Silver Powders and Flakes for Flex/IME Applications

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Presenter: – Metalor

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11:00 AM – 11:10 AM PDT

Cost Effective Flexible Electronics Solutions

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Presenter: – Tapecon

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11:15 AM – 11:25 AM PDT

Innovative Portfolio of FHE Technology

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – NexTex Ventures (NTVUSA)

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11:30 AM – 11:40 AM PDT

Flexible Electronics: Quantifying Liquid Metal Adhesion by Contact Angle & Adhesive Force Measurements

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – DataPhysics Instruments USA Corp.

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11:45 AM – 11:55 AM PDT

Printing Traces with Gravure Offset

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Komori America

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10:30 AM – 10:50 AM PDT

Resonac’s Open Innovation at Advanced Package

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Resonac

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10:50 AM – 11:10 AM PDT

Pick and Place Parameter Optimization for Tacky Device Carriers

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Gel-Pak

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11:10 AM – 11:30 AM PDT

Additively Manufactured Flexible “Smart” Packaging and On-Package Antennas for 5G/mmWave Systems

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Georgia Institute of Technology

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11:30 AM – 11:50 AM PDT

Development and Validation of The Flexible Package Technology on EMG Sensor Based Smart System

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Industrial Technology Research Institute

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11:50 AM – 12:10 PM PDT

Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die Types

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Universal Instruments

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10:30 AM – 10:50 AM PDT

Process-Property Interactions for Additive Sustainable-Ink Circuits with Component Attachment

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Auburn University

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10:50 AM – 11:10 AM PDT

Design and Testing of Encapsulated RF Structures for Flexible and Hybrid Electronic Applications

Location: Moscone South, Exhibition Level, Room 11

Speaker: – NextFlex

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11:10 AM – 11:30 AM PDT

A Disruptive Dry Multimaterial Printer for Electronics, Sensors, and Functional Devices

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Auburn University/NanoPrintek, Inc.

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11:30 AM – 11:50 AM PDT

Reliability of Copper based Printed Electronic Flexible Circuits

Location: Moscone South, Exhibition Level, Room 11

Speaker: – MiQro Innovation Collaborative Center (C2MI)

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11:50 AM – 12:10 PM PDT

From One to Many: Challenges to Printed Electronics Reliability at Scale

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Bayflex Solutions

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10:30 AM – 10:32 AM PDT

Welcome Remarks

Location: Moscone North, Exhibition Level, Room 21

Session Moderator: – SEMI

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10:32 AM – 10:35 AM PDT

Welcome Remarks

Location: Moscone North, Exhibition Level, Room 21

Session Moderator: – Entegris Inc.

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10:35 AM – 10:50 AM PDT

Making Hard Things Easier: Applied Materials Solutions for Silicon Carbide

Location: Moscone North, Exhibition Level, Room 21

Speaker: – Applied Materials

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10:50 AM – 11:10 AM PDT

Accelerating SiC Commercialization and Barriers to Overcome

Location: Moscone North, Exhibition Level, Room 21

Speaker: – PowerAmerica

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11:10 AM – 11:30 AM PDT

Breaking down barriers: How closer cooperation along the value chain can help a widespread SiC adoption and ensure a resilient supply.

Location: Moscone North, Exhibition Level, Room 21

Speaker: – Robert Bosch GmbH

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11:30 AM – 11:50 AM PDT

Progress in SiC Manufacturing Boosts Vehicle Electrification

Location: Moscone North, Exhibition Level, Room 21

Speaker: – STMicroelectronics

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11:50 AM – 12:05 PM PDT

Purpose Driven Design: Advancing SiC Technology into the Future!

Location: Moscone North, Exhibition Level, Room 21

Speaker: – Axus Technology

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12:05 PM – 12:20 PM PDT

SmartSiC™: a greener, faster and better technology for SiC

Location: Moscone North, Exhibition Level, Room 21

Speaker: – SOITEC

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12:20 PM – 12:35 PM PDT

Meeting the SiC gold rush with Entegris Capabilities.

Location: Moscone North, Exhibition Level, Room 21

Speaker: – Entegris

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10:30 AM – 10:35 AM PDT

Welcome Remarks and Session Introduction

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Session Moderator: – Deloitte

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10:35 AM – 10:55 AM PDT

Connecting the Dots: From KPIs to Smart Manufacturing Applications to Industry Standards

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Cimetrix by PDF Solutions

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10:55 AM – 11:15 AM PDT

Maintenance Content Reduction and Digitalization for Performance Optimization

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – INFICON

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11:15 AM – 11:35 AM PDT

Supply Chain Visibility and Resilience: IBM Case-Study

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – IBM Semiconductor

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11:35 AM – 11:55 AM PDT

Accelerating Global Semiconductor Manufacturing

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Tignis

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11:55 AM – 12:15 PM PDT

Scalable Semiconductor Fab Production Scheduling Using Reinforcement Learning and Microsoft Azure

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – minds.ai

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12:15 PM – 12:35 PM PDT

Capacity Planning and Material Flow Optimisation in the Fab – How to Make it Smart(er)

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – D-SIMLAB Technologies Pte Ltd

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12:35 PM – 12:40 PM PDT

Closing Remarks

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Session Moderator: – Deloitte

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10:30 AM – 10:35 AM PDT

Welcome Remarks and Session Overview

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Session Moderator: – Instant Insight Inc.

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10:35 AM – 10:55 AM PDT

Holistic Patterning to Enable Manufacturing for 2nm and Beyond

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – ASML

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10:55 AM – 11:15 AM PDT

Three Innovations in Ebeam Technology to Accelerate EUV Lithography, Gate-All-Around Transistors and High Aspect Ratio Memories & Interconnects.

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Applied Materials

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11:15 AM – 11:35 AM PDT

Outlook for Advanced Logic Era: Process Innovation to Address Scaling Challenges

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Tokyo Electron America, inc.

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11:35 AM – 11:55 AM PDT

Patterning Challenges in the Era of Vertical Scaling

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – IBM

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11:55 AM – 12:15 PM PDT

The Advent of Quantum Computing: Thanks to CMOS Technologies

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Siquance

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12:15 PM – 12:30 PM PDT

Q&A (Morning Session)

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Session Moderator: – Instant Insight Inc.

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1:30 PM – 1:35 PM PDT

Welcome Remarks (Afternoon Session)

Session Moderator: – Instant Insight Inc.

1:35 PM – 1:55 PM PDT

EUVL Dry Resist for the 1nm Node and Beyond

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Lam Research

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1:55 PM – 2:15 PM PDT

Patterning Challenges and Innovations on the Eve of High NA EUV Lithography

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – imec

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2:15 PM – 2:35 PM PDT

Challenges and Building Blocks for 2030 Scaling and Beyond

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Intel Corporation

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2:35 PM – 2:55 PM PDT

Enabling Moore's Law Through Heterogeneous Integration

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – AMD

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2:55 PM – 3:15 PM PDT

Challenges & Opportunities For Developing Superconducting Quantum Information Systems

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – National Institute of Standards & Technology

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3:15 PM – 3:30 PM PDT

Q&A and Closing Remarks

Session Moderator: – Instant Insight Inc.

10:30 AM – 10:55 AM PDT

Keynote:The Power of Partnership: Accelerating Sustainability Innovation

Location: Moscone South, Exhibition Level, Room 2

Keynote Speaker: – Micron

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10:55 AM – 11:20 AM PDT

Keynote: Sustainable Semiconductor Initiatives - Learning from Abroad

Location: Moscone South, Exhibition Level, Room 2

Keynote Speaker: – TEL Ventures

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11:30 AM – 2:00 PM PDT

Startup Presentations

Location: Moscone South, Exhibition Level, Room 2

Speaker: – Multiscale Technologies

Speaker: – CFEX

Speaker: – GRAPHEC

Speaker: – Aqua Membranes

Speaker: – ElectraMet

Speaker: – Innoflex

Speaker: – L2X Labs

Speaker: – Purity Resource

Speaker: – Corintis

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2:00 PM – 3:00 PM PDT

Panel: Role of CVC's in Sparking Sustainability Innovations

Location: Moscone South, Exhibition Level, Room 2

Panel Session Moderator: – M Ventures

Panelist: – Intel Capital

Panelist: – Lam Research

Panelist: – SK Hynix

Panelist: – TEL

Panelist: – Enterprise Singapore

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10:30 AM – 11:25 AM PDT

Upskilling the Microelectronics Workforce Via Non-traditional Pathways

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Panel Session Moderator (WFD Session): – MACNY – The Manufacturers Association

Panelist (WFD Session): – Mohawk Valley Community College (NY)

Panelist (WFD Session): – State University of New York

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11:30 AM – 11:55 AM PDT

Workforce Development Initiatives through Collaborative Efforts

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – Cornell Nanoscale Science & Technology Facility

Speaker (WFD Pavilion): – Tompkins Cortland Community College

Speaker (WFD Pavilion): – Odyssey Semiconductor

Speaker (WFD Pavilion): – Tompkins Cortland Community College

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12:00 PM – 12:25 PM PDT

Purdue University Pilot Workforce Development Programs for the Semiconductor Industry

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – Purdue University

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1:00 PM – 4:00 PM PDT

HTU 2.0

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

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1:00 PM – 1:10 PM PDT

New Perspectives to Improve Reliability for Printed Electronics

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Bayflex Solutions

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1:15 PM – 1:25 PM PDT

Material and Coating Innovation at Argonne National Laboratory

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Argonne National Laboratory

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1:30 PM – 1:40 PM PDT

Wafer Metallization with Additive, Metal Complex Inks

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Electroninks Inc.

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1:45 PM – 1:55 PM PDT

Unlocking the Future of Printed Electronics

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Voltera

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2:00 PM – 2:10 PM PDT

Flat Panel Semiconductor Manufacturing

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – InnovaFlex Foundry

1:30 PM – 1:50 PM PDT

Die-to-Wafer Hybrid Bonding to address Next-Gen Electronics Packaging Challenges

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Applied Materials

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1:50 PM – 2:10 PM PDT

Stretchable Thermoelectric Generators and Peltier Coolers for Wearable Applications

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Carnegie Mellon University

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2:10 PM – 2:30 PM PDT

Ultra-thin Chiplet Integration for small-scale flexible Devices by Micro-Transfer Printing

Location: Moscone South, Exhibition Level, Room 11

Speaker: – X-FAB MEMS Foundry

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2:30 PM – 2:50 PM PDT

Advanced Hybrid Printing Processes for Complex Metal Dielectric Structures via Three-Axis Systems

Location: Moscone South, Exhibition Level, Room 11

Speaker: – The University of Texas at El Paso

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1:30 PM – 1:50 PM PDT

Highly Conductive Transparent Electrodes Based on Embedded Metal-mesh and Applications

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Jiangsu Industrial Technology Research Institute

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1:50 PM – 2:10 PM PDT

Modular microcontrollers for rapidly configurable IOT devices

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – NextFlex

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2:10 PM – 2:30 PM PDT

Non-contact Capacitive Coupling-based EMG Sensing System for Smart Armband Applications

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Industrial Technology Research Institute

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2:30 PM – 2:50 PM PDT

Flexible Hybrid Electronics Sensors for Product Quality Monitoring and Logistics Applications

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Yamagata University

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1:30 PM – 1:35 PM PDT

Welcome Remarks and Session Introduction

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Session Moderator: – SEMI

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1:35 PM – 1:55 PM PDT

Multi-tier Supplier Network Operations Visibility

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Deloitte Consulting

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1:55 PM – 2:15 PM PDT

Health of the Semiconductor Supply Chain: An Inside Look

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – McKinsey & Company

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2:15 PM – 2:35 PM PDT

Cutting-Edge Technology Deserves Cutting-Edge Supply Chain Management

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – IBM

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2:35 PM – 2:55 PM PDT

The State of Michigan and New Models of Supply Chain Agility, Collaboration and Innovation

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Michigan Economic Development Corporation (MEDC)

Speaker: – Michigan Economic Development Corporation

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2:55 PM – 3:15 PM PDT

How To Prepare for Unprecedented Growth and Risk in the Semiconductor Industry

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Presenter: – Genpact

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3:15 PM – 3:35 PM PDT

Supply Chain Management for the Semiconductor Fab of the Future

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Joun Technologies

Speaker: – Kearney

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3:35 PM – 3:40 PM PDT

Closing Remarks

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Session Moderator: – SEMI

Expo PassExpo Plus PassThought Leadership PassAll-In PassStudent Explorer Pass

Full Schedule

Full Schedule

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