Full Schedule

9:00 AM – 10:00 AM PDT

International SOI Wafer Task Force Meeting [Silicon Wafer]

Location: Moscone South, Level 3

Standards

9:00 AM – 10:00 AM PDT

Materials of Construction of Gas Delivery Systems Task Force Meeting [Gases]

Location: Moscone South, Level 3

Standards

9:00 AM – 10:00 AM PDT

North America Information & Control Leadership Meeting (By Invitation Only) [I&C]

Location: Moscone South, Level 3

Standards

10:00 AM – 11:00 AM PDT

Filters & Purifiers Task Force Meeting [Gases]

Location: Moscone South, Level 3

Standards

10:00 AM – 11:00 AM PDT

International Polished Wafer Task Force Meeting [Silicon Wafer]

Location: Moscone South, Level 3

Standards

10:00 AM – 12:00 PM PDT

GEM300 Task Force Meeting [I&C]

Location: Moscone South, Level 3

Standards

11:00 AM – 12:00 PM PDT

International Test Methods Task Force Meeting [Silicon Wafer]

Location: Moscone South, Level 3

Standards

11:00 AM – 12:00 PM PDT

Mass Flow Controller Task Force Meeting [Gases]

Location: Moscone South, Level 3

Standards

12:00 PM – 1:00 PM PDT

Silicon Wafer Global Coordinating Subcommittee Meeting (By Invitation Only)

Location: Moscone South, Level 3

Standards

1:00 PM – 2:00 PM PDT

Gases Specification Task Force Meeting [Gases]

Location: Moscone South, Level 3

Standards

1:00 PM – 2:00 PM PDT

International Automated Advanced Surface Inspection Task Force Meeting [Silicon Wafer]

Location: Moscone South, Level 3

Standards

1:00 PM – 3:00 PM PDT

Advanced Backend Factory Integration (ABFI) Task Force Meeting [I&C]

Location: Moscone South, Level 3

Standards

1:00 PM – 4:00 PM PDT

International Compliance and Regulatory Committee Meeting (ICRC) [SEMI EHSS Division]

Location: Moscone South, Level 3

Standards

1:00 PM – 5:00 PM PDT

SEMI Market Symposium

Location: SF Marriott Marquis, Golden Gate A

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Sponsors

1:00 PM – 1:05 PM PDT

SEMI Market Symposium: Welcome Remarks

Location: SF Marriott Marquis, Golden Gate A

Session Moderator: – SEMI

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1:05 PM – 1:35 PM PDT

Intersection of Trends, Markets, and Capabilities - Electronics Manufacturing Ecosystem

Location: SF Marriott Marquis, Golden Gate A

Speaker: – Jabil

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1:35 PM – 2:05 PM PDT

Impact of Geopolitical and Market Drivers on Semiconductor Supply Chain

Location: SF Marriott Marquis, Golden Gate A

Speaker: – Strategy and Transactions, EY-Parthenon

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2:05 PM – 2:35 PM PDT

M&A, Regulatory and Capital Markets Environment

Location: SF Marriott Marquis, Golden Gate A

Speaker: – Goldman Sachs & Co.

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2:35 PM – 3:05 PM PDT

$1 T Chip Industry Roadmap With Net Zero Target

Location: SF Marriott Marquis, Golden Gate A

Speaker: – Gartner

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3:25 PM – 3:55 PM PDT

Sustainable Growth Into the Future

Location: SF Marriott Marquis, Golden Gate A

Speaker: – TechInsights

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3:55 PM – 4:25 PM PDT

The Rise of Automotive Semiconductors – A Packaging Perspective

Location: SF Marriott Marquis, Golden Gate A

Speaker: – Amkor Technology

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4:25 PM – 4:55 PM PDT

World Fab Forecast: Trends and Forecast for New Fabs, Fab Equipment Spending and Capacities.

Location: SF Marriott Marquis, Golden Gate A

Speaker: – SEMI

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4:55 PM – 5:00 PM PDT

SEMI Market Symposium Closing Remarks

Location: SF Marriott Marquis, Golden Gate A

Session Moderator: – SEMI

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1:30 PM – 2:00 PM PDT

High Purity Liquid Assemblies & System Task Force Meeting [Liquid Chemicals]

Location: Moscone South, Level 3

Standards

2:00 PM – 3:00 PM PDT

Chemical Analytical Methods (CAM) Task Force Meeting [Liquid Chemicals]

Location: Moscone South, Level 3

Standards

2:00 PM – 3:00 PM PDT

Heater Jacket Task Force Meeting [Gases]

Location: Moscone South, Level 3

Standards

2:00 PM – 5:00 PM PDT

International Advanced Wafer Geometry Task Force Meeting [Silicon Wafer]

Location: Moscone South, Level 3

Standards

3:00 PM – 3:30 PM PDT

Chemical Mechanical Planarization Consumables (CMP-C) Task Force Meeting [Liquid Chemicals]

Location: Moscone South, Level 3

Standards

3:00 PM – 5:00 PM PDT

Equipment Data Publication (EDP) Task Force Meeting [I&C]

Location: Moscone South, Level 3

Standards

4:00 PM – 5:00 PM PDT

S23 Revision Global Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

5:00 PM – 6:00 PM PDT

Control of Hazardous Energy Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

5:30 PM – 7:00 PM PDT

SEMI Welcome Reception

Location: SF Marriott Marquis, View Lounge

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Sponsors

6:00 PM – 8:00 PM PDT

North America Regional Standards Committee (NARSC) Business Meeting (By Invitation Only)

Location: Moscone South, Level 3

Standards

8:00 AM – 10:00 AM PDT

Graphical User Interfaces (GUI) Task Force Meeting [I&C]

Location: Moscone South, Level 3

Standards

8:00 AM – 10:00 AM PDT

S2 Mechanical Design Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

8:00 AM – 11:00 AM PDT

CEO Summit: Path to $1T

Location: Keynote Stage, Room 24, North Lower Lobby

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8:00 AM – 8:10 AM PDT

CEO Summit: Path to $1T Welcome Remarks

Location: Keynote Stage, Room 24, North Lower Lobby

Speaker: – SEMI

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8:10 AM – 8:20 AM PDT

CEO Summit: Path to $1T Opening Remarks

Location: Keynote Stage, Room 24, North Lower Lobby

Speaker: – SEMI

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8:20 AM – 8:30 AM PDT

CEO Summit: Message from the Chairperson, SEMI International Board of Directors

Location: Keynote Stage, Room 24, North Lower Lobby

Speaker: – Axcelis Technologies

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8:30 AM – 8:55 AM PDT

Keynote: The Virtual Path To A Trillion-Dollar Reality

Location: Keynote Stage, Room 24, North Lower Lobby

Keynote Speaker: – Lam Research

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8:55 AM – 9:20 AM PDT

Keynote: Keys to Create $1T Shared Value

Location: Keynote Stage, Room 24, North Lower Lobby

Keynote Speaker: – Tokyo Electron Limited

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9:20 AM – 9:30 AM PDT

North America Advisory Board Service Awards

Location: Keynote Stage, Room 24, North Lower Lobby

Speaker: – SEMI

9:30 AM – 9:55 AM PDT

Keynote: Compound Semiconductors: Taking Center Stage

Location: Keynote Stage, Room 24, North Lower Lobby

Keynote Speaker: – Coherent

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9:55 AM – 10:10 AM PDT

Presentation of the SEMI Award for North America

Location: Keynote Stage, Room 24, North Lower Lobby

Speaker: – SEMI

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10:10 AM – 10:35 AM PDT

Keynote: Navigating the semiconductor Supply Chain Transformation

Location: Keynote Stage, Room 24, North Lower Lobby

Keynote Speaker: – DHL Supply Chain

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10:35 AM – 11:00 AM PDT

Keynote: Combining Accuracy and Throughput for next SEMICON Industries Challenges

Location: Keynote Stage, Room 24, North Lower Lobby

Keynote Speaker: – DR. JOHANNES HEIDENHAIN GmbH

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10:00 AM – 5:00 PM PDT

VIP Lounge Open

Location: Moscone North, VIP Lounge

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9:00 AM – 10:00 AM PDT

Ultra Pure Water (UPW) Task Force Meeting [Liquid Chemicals]

Location: Moscone South, Level 3

Standards

9:00 AM – 12:00 PM PDT

Facilities & Gases North America Technical Committee Chapter Meeting

Location: Moscone South, Level 3

Standards

9:00 AM – 12:00 PM PDT

Silicon Wafer North America Technical Committee Chapter Meeting

Location: Moscone South, Level 3

Standards

10:00 AM – 11:00 AM PDT

Energy Saving Equipment Communication (ESEC) Task Force Meeting [I&C]

Location: Moscone South, Level 3

Standards

10:00 AM – 11:00 AM PDT

Water Management Task Force Meeting [Liquid Chemicals]

Location: Moscone South, Level 3

Standards

10:00 AM – 12:00 PM PDT

Energetic Materials EHS Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

10:00 AM – 3:00 PM PDT

Packaging Tape Frame Handling Task Force Meeting [PIC]

Location: Moscone South, Level 3

Standards

10:30 AM – 11:00 AM PDT

Best of West: High Accuracy Wafer Thickness Mapping System, TMS-2000 Presented by Santec

Location: Best of West Stage

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10:30 AM – 12:30 PM PDT

Bio-Sensor Innovation for Smarter MedTech

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

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10:30 AM – 10:40 AM PDT

Welcome to Bio-Sensor Innovation for Smarter MedTech

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Session Chair: – UES, Inc.

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10:40 AM – 11:05 AM PDT

Deloitte Weighs in on MedTech Trends and Opportunities

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Deloitte

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11:05 AM – 11:20 AM PDT

Fabrication, characterization, and in vivo validation of biodegradable, optical oxygen sensors

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – UES, Inc./Air Force Research Laboratory (AFRL)

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11:20 AM – 11:35 AM PDT

Textile EMG Sensors for Bluetooth Electromyography-based Stroke Therapeutic (BEST) system

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – North Carolina State University

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11:35 AM – 11:50 AM PDT

Screen Printed SiC Humidity Sensors for Simultaneous Respiration Rate and Mask Fouling Detection

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – ETS - École de technologie supérieure

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11:50 AM – 12:05 AM PDT

Wearable Fabric Sensing Device for Dysphagia Measurement and Monitoring

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – The University of Texas at Austin

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12:05 PM – 12:20 PM PDT

Persistent Human-Machine Interfaces for Robotic Arm Control Via Gaze and Eye Direction Tracking

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Georgia Institute of Technology

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12:20 PM – 12:30 PM PDT

Closing Remarks

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Session Chair: – UES, Inc.

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10:30 AM – 12:30 PM PDT

Sustainable Synergy: Balancing Semiconductor Growth and Environmental Sustainability

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

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10:30 AM – 10:35 AM PDT

Opening Remarks

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Session Moderator: – EMD Electronics

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10:35 AM – 11:00 AM PDT

Navigating Climate Regulatory Risks in Semiconductor Manufacturing

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Glencoe Strategies

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11:00 AM – 11:25 AM PDT

EU F-Gas: Proposal for a Regulation, International Context and Regulatory Process

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – TEL

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11:25 AM – 11:50 AM PDT

Sustainability for Material Supplier in Semiconductor

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – EMD Electronics

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11:50 AM – 12:25 PM PDT

Panel: Sustainable Synergy: Balancing Semiconductor Growth and Environmental Responsibility

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Panel Session Moderator: – Arkema

Panelist: – EMD Electronics

Panelist: – Glencoe Strategies

Panelist: – TEL

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12:25 PM – 12:30 PM PDT

Closing Remarks

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Session Moderator: – SEMI

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10:30 AM – 12:55 PM PDT

Connectivity & Security Infrastructure

Location: Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F

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10:30 AM – 10:35 AM PDT

Welcome Remarks and Session Introduction

Location: Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F

Session Moderator: – SEMI

Session Moderator: – Applied Materials

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10:35 AM – 10:50 AM PDT

Autonomous Factory/Smart Control Room

Location: Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F

Speaker: – Inficon

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10:50 AM – 11:10 AM PDT

Adopting Cybersecurity Standards for Semiconductor Factories

Location: Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F

Speaker: – PEER Group

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11:10 AM – 11:30 AM PDT

Sensor Integration Framework with Interface A (EDA)

Location: Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F

Speaker: – Kontron AIS

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11:30 AM – 11:50 AM PDT

Secure Equipment for Secure Smart Manufacturing

Location: Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F

Speaker: – HCL Technologies

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11:50 AM – 12:10 PM PDT

Factory Control Systems: Integrating Process-Specific Support Equipment Emphasizing Safety Systems

Location: Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F

Speaker: – Shermco Systems Integration

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12:10 PM – 12:30 PM PDT

Unlocking Innovation: The Power of Secure Data Sharing in the Semiconductor Manufacturing

Location: Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F

Speaker: – Amazon Web Services

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12:30 PM – 12:50 PM PDT

Zero-touch Deployment and Maintenance of Edge Compute Environments with Rancher by SUSE

Location: Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F

Speaker: – SUSE

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12:50 PM – 12:55 PM PDT

Closing Remarks

Location: Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F

Session Moderator: – Applied Materials

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10:30 AM – 4:00 PM PDT

Creating a Diverse and Inclusive Industry

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

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10:30 AM – 10:55 AM PDT

Data of Diversity

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – TEL

Speaker (WFD Pavilion): – SEMI Foundation

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11:00 AM – 11:25 AM PDT

Cultivating a Culture of Belonging

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – San Jose State University

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11:30 AM – 12:25 PM PDT

Women in Semiconductors – On Allyship

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Panel Session Moderator (WFD Session): – SEMI Foundation

Panelist (WFD Session): – Athinia Technologies LLC

Panelist (WFD Session): – Comet Technologies USA, Inc.

Panelist (WFD Session): – Edwards

Panelist (WFD Session): – Nikon Precision

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1:30 PM – 2:25 PM PDT

Serving Diverse Communities through Two-Year Colleges

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – Salt Lake Community College

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2:30 PM – 2:55 PM PDT

Investing to Inspire and Attract Under-represented Minorities at HBCUs and HSIs

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – EMD Electronics

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3:00 PM – 3:25 PM PDT

Building a Better Network: Crucial Conversations

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – EMD Electronics

Speaker (WFD Pavilion): – Lam Research

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3:30 PM – 3:55 PM PDT

Diversity Through Veteran Hiring

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – NYCREATES/SUNY Polytechnic Institute

Speaker (WFD Pavilion): – SEMI Foundation

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10:30 AM – 5:30 PM PDT

Climate Equity & Social Impact

Location: Moscone South, Exhibition Level, Room 2

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Sponsors

10:30 AM – 11:00 AM PDT

Climate Equity & Social Impact: Opening Remarks

Location: Moscone South, Exhibition Level, Room 2

Speaker (Climate Equity & Social Impact Session): – SEMI

Speaker (Climate Equity & Social Impact Session): – EMD Electronics

Speaker (Climate Equity & Social Impact Session): – National Wildlife Federation

Speaker (Climate Equity & Social Impact Session): – WE ACT

Speaker (Climate Equity & Social Impact Session): – California Environmental Protection Agency (Cal EPA)

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11:00 AM – 11:40 AM PDT

Circularity

Location: Moscone South, Exhibition Level, Room 2

Speaker (Climate Equity & Social Impact Session): – GlobalFoundries

Speaker (Climate Equity & Social Impact Session): – U.S. EPA

Speaker (Climate Equity & Social Impact Session): – Keep the Bay Beautiful

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11:50 AM – 12:30 PM PDT

Alliance for Clean Air

Location: Moscone South, Exhibition Level, Room 2

Speaker (Climate Equity & Social Impact Session): – Sonoma Technology

Speaker (Climate Equity & Social Impact Session): – Stockholm Environment Institute

Speaker (Climate Equity & Social Impact Session): – Sonoma Technology

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1:00 PM – 1:40 PM PDT

Panel: Just Transition & Climate Equity

Location: Moscone South, Exhibition Level, Room 2

Panel Moderator (Climate Equity & Social Impact): – National Wildlife Federation

Panel Moderator (Climate Equity & Social Impact): – Climate Equity Collaborative / NWF

Panelist (Climate Equity & Social Impact Session): – National Oceanic & Atmospheric Administration (NOAA)

Panelist (Climate Equity & Social Impact Session): – General Motors

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1:50 PM – 2:30 PM PDT

Accelerating Innovation Through Public-Private Partnership

Location: Moscone South, Exhibition Level, Room 2

Speaker (Climate Equity & Social Impact Session): – CHIPS for America

Speaker (Climate Equity & Social Impact Session): – Climate Equity Collaborative / NWF

Speaker (Climate Equity & Social Impact Session): – Accenture

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2:40 PM – 3:20 PM PDT

Panel: Leveraging Technology for Impact

Location: Moscone South, Exhibition Level, Room 2

Panel Moderator (Climate Equity & Social Impact): – SEMI

Panelist (Climate Equity & Social Impact Session): – ASML

Panelist (Climate Equity & Social Impact Session): – Tech Exchange

Panelist (Climate Equity & Social Impact Session): – Western DIgital

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3:30 PM – 4:10 PM PDT

Protecting Children in a Changing Climate

Location: Moscone South, Exhibition Level, Room 2

Session Moderator (Climate Equity & Social Impact): – Climate Equity Collaborative

Speaker (Climate Equity & Social Impact Session): – CalEPA Children's Environmental Health Center at the Office of Environmental Health

Speaker (Climate Equity & Social Impact Session): – Children's Environmental Health Network (CEHN)

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4:20 PM – 5:00 PM PDT

Panel: Employee Impact Groups

Location: Moscone South, Exhibition Level, Room 2

Panel Moderator (Climate Equity & Social Impact): – Clever Carbon / Women and Climate

Panelist (Climate Equity & Social Impact Session): – ASML

Panelist (Climate Equity & Social Impact Session): – Lam Research

Panelist (Climate Equity & Social Impact Session): – TEL - Tokyo Electron US Holdings

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5:00 PM – 5:30 PM PDT

Climate Equity & Social Impact: Call-to-Action Promise for Impact

Location: Moscone South, Exhibition Level, Room 2

Speaker (Climate Equity & Social Impact Session): – SEMI

Speaker (Climate Equity & Social Impact Session): – Climate Equity Collaborative / National Wildlife Federation

Speaker (Climate Equity & Social Impact Session): – Carnegie Mellon University

Speaker (Climate Equity & Social Impact Session): – University of Toronto

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5:30 PM – 6:30 PM PDT

Climate Equity & Social Impact Networking

Location: Moscone South, Exhibition Level, Room 2, Sustainabilty Lounge

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10:45 AM – 12:45 PM PDT

FLEX Conference Keynotes

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Session Chair: – SEMI

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Sponsored By

10:45 AM – 11:00 AM PDT

FLEX Conference Welcome Remarks

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – SEMI

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11:00 AM – 11:30 AM PDT

Simplifying the IC Ecosystem

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Keynote Speaker: – Pragmatic Semiconductor

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11:30 AM – 12:00 PM PDT

The Very Big Picture on Materials – All of the Options Fit to Print

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Keynote Speaker: – Rice University, Baker Institute for Public Policy

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12:00 PM – 12:30 PM PDT

Advancing Additively Manufactured Electronics (AME) for Heterogeneous Integration

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Keynote Speaker: – Meta Reality Labs – Research

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12:30 PM – 12:45 PM PDT

FLEX Conference Closing Remarks

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – SEMI

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11:00 AM – 12:00 PM PDT

High Purity Polymer Material & Components Task Force Meeting [Liquid Chemicals]

Location: Moscone South, Level 3

Standards

11:00 AM – 12:00 PM PDT

Process Control System (PCS) Task Force Meeting [I&C]

Location: Moscone South, Level 3

Standards

11:15 AM – 11:45 AM PDT

Best of West: Quadra 7 Pro MXI Presented by Nordson

Location: Best of West Stage

Presenter:

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11:30 AM – 3:30 PM PDT

Food Trucks Open

Location: Moscone North, Hall F

11:30 AM – 3:30 PM PDT

Taste of San Francisco Lunch: North Beach Day

Location: Moscone South, Expo Hall

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1:00 PM – 1:45 PM PDT

Generative AI in Semiconductors

Location: Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F

Speaker: – Deloitte

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1:00 PM – 2:00 PM PDT

Navigating Uncertainty-How Do You Build Agile Supply Chains?

Location: Keynote Stage, Room 24, North Lower Lobby

Panel Session Moderator: – SEMI

Panelist: – Dell

Panelist: – Intel Corporation

Panelist: – KLA

Panelist: – McKinsey & Company

Panelist: – Resilinc

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1:00 PM – 2:00 PM PDT

S1 (Labels) Revision Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

1:00 PM – 2:00 PM PDT

Statistical Methods Task Force Meeting [Liquid Chemicals]

Location: Moscone South, Level 3

Standards

1:00 PM – 4:00 PM PDT

Diagnostic Data Acquisition (DDA) Task Force Meeting [I&C]

Location: Moscone South, Level 3

Standards

1:15 PM – 1:45 PM PDT

Best of West: W77Q128 Secure Flash Presented by Winbond Electronics

Location: Best of West Stage

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1:30 PM – 2:30 PM PDT

Joint MSIG Working Group and MEMS Task Force Meeting

Location: Moscone South, Level 3

Standards

1:30 PM – 3:10 PM PDT

FLEX Conference: Integration & Packaging

Location: Moscone South, Exhibition Level, Room 11

Session Chair: – Auburn University

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1:30 PM – 1:50 PM PDT

The Internet of Trillions of Things will be Flexible Hybrid Electronics, powered by light

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Epishine AB

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1:50 PM – 2:10 PM PDT

Co-packaging of integrated optics with electronics recurring to a Si platform holder

Location: Moscone South, Exhibition Level, Room 11

Speaker: – PICadvanced

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2:10 PM – 2:30 PM PDT

Advanced FHE Bend, Twist Testing and Standardization

Location: Moscone South, Exhibition Level, Room 11

Speaker: – American Semiconductor, Inc.

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2:30 PM – 2:50 PM PDT

Ultra-Thin Parylene PCBs for Highly Flexible Sensors and Considerations for Their Mass Production

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Fraunhofer Institute for Electronic Nano Systems

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2:50 PM – 3:10 PM PDT

Planar SiC Power Module Packaging with Printed Interconnections

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Binghamton University, State University of New York

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1:30 PM – 3:10 PM PDT

FLEX Conference: Strategy & Business I

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Session Chair: – Eastman Kodak Company

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Sponsor

1:30 PM – 1:50 PM PDT

Employer-led Apprenticeship Solutions to Workforce Challenges

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Tapecon

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1:50 PM – 2:10 PM PDT

Reliability Data: Recent Test Criteria and Opportunities for Flexible Electronics Applications

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Bayflex Solutions

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2:10 PM – 2:30 PM PDT

Strategies for bringing wearable biosensor devices to the medical market

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Intricon

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2:30 PM – 2:50 PM PDT

Technology gaps and market opportunities across printed/flexible electronics

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – IDTechEx

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2:50 PM – 3:10 PM PDT

Metal Complex Inks and Films for Additive Manufacturing

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Co-Presenter: – Electroninks Inc.

Speaker: – Electroninks

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2:00 PM – 2:30 PM PDT

Best of West: ACS Unified Server, Presented by Advantest

Location: Best of West Stage

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2:00 PM – 4:00 PM PDT

Liquid Chemicals North America Technical Committee Chapter Meeting - Day 1

Location: Moscone South, Level 3

Standards

2:00 PM – 4:00 PM PDT

Market and Manufacturing Trends for MedTech Sensors

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

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2:00 PM – 2:10 PM PDT

Welcome to Market & Manufacturing Trends for MedTech Sensors

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Session Chair: – Arieca Inc

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2:10 PM – 2:25 PM PDT

Pilot converting of next generation wearables towards high quality manufacturing processes

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – VTT Technical Research Center of Finland Ltd

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2:25 PM – 2:40 PM PDT

Wireless Vital Sign Monitoring Devices for Ambulatory Aeromedical Care

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – GE Research

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2:40 PM – 2:55 PM PDT

Continuous Cardiac Biometric Security Enabled by Soft and Wearable Digital Stethoscope

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Georgia Institute of Technology

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2:55 PM – 3:10 PM PDT

Predicting Onset of Bradycardia in Premature Infants Using ECG Signals

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – The University of Texas at Austin

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3:10 PM – 3:25 PM PDT

Gecko-Inspired Soft Electrodes for Robust & Reusable Bioelectronic Stickers

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Carnegie Mellon University | Soft Machines Lab

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3:25 PM – 3:40 PM PDT

Manufacturing Considerations for Wearables

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Tapecon

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3:40 PM – 3:55 PM PDT

Addressing unmet needs with 3D printed electronics and ingestible systems

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – University of Utah

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3:55 PM – 4:00 PM PDT

Closing Remarks

Location: Smart MedTech Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Session Chair: – Arieca Inc

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2:00 PM – 4:00 PM PDT

S6 Revision Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

2:00 PM – 4:30 PM PDT

Enabling New Products with Advanced Substrates

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

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2:00 PM – 2:05 PM PDT

Welcome and Session Overview

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Session Moderator: – Soitec

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2:05 PM – 2:30 PM PDT

SiC Wafer Markets and Manufacturing Trends

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Techcet

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2:30 PM – 3:00 PM PDT

Latest Development in Silicon Substrates for RF devices

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Okmetic

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3:00 PM – 3:30 PM PDT

SAW Filters on POI Wafers Addressing New Telecommunication Standard Challenges

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Soitec

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3:30 PM – 4:00 PM PDT

RFSOI Technology for the RF Front-End: Then, Now and Tomorrow

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – GlobalFoundries

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4:00 PM – 4:25 PM PDT

Q&A Panel: Enabling New Products with Advanced Substrates

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Panel Session Moderator: – Okmetic

Panelist: – GlobalFoundries

Panelist: – Okmetic

Panelist: – Soitec

Panelist: – Techcet

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4:25 PM – 4:30 PM PDT

Closing Remarks

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Session Moderator: – Soitec

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2:00 PM – 4:40 PM PDT

Automation & Equipment Toward Fully Autonomous Factories

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

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2:00 PM – 2:05 PM PDT

Welcome Remarks and Session Introduction

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Session Moderator: – PEER Group

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2:05 PM – 2:20 PM PDT

SEMI Roadmap Vision: Autonomous Factory of the Future

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Deloitte

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2:20 PM – 2:40 PM PDT

The Smart Subfab: Resource and Cost Savings with Intelligent Systems Integration and Control

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – INFICON

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2:40 PM – 3:00 PM PDT

Eliminating Unexpected Production Failure Through a Smart Vacuum Solution

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Pfeiffer Vacuum

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3:00 PM – 3:20 PM PDT

Integration of Mobile Robotics for Automated Material Handling

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – KUKA Robotics

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3:20 PM – 3:40 PM PDT

AI/ML in Semiconductor: Areas of Greatest Return on Investment

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Rockwell Automation

Speaker: – Kalypso

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3:40 PM – 4:00 PM PDT

Digital Energy Threads: Digitization of Energy Control Loops in Semiconductor Plants

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Schneider Electric

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4:00 PM – 4:20 PM PDT

Lessons Learned to Utilize Predictive Maintenance for Semiconductor Manufacturing

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – SAS

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4:20 PM – 4:35 PM PDT

IRAM – Industry4 Readiness Assessment Model a Tool to Guide and Measure progress of your Smart Manufacturing Journey

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Siemens

Speaker: – TEL

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4:35 PM – 4:40 PM PDT

Closing Remarks

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Session Moderator: – PEER Group

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2:45 PM – 3:15 PM PDT

Best of West: DOT Tester Auto Maintenance Presented by SPEA

Location: Best of West Stage

Presenter: – SPEA S.p.A.

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3:00 PM – 4:00 PM PDT

Electron Microscopy (EM) Workflow Task Force Meeting

Location: Moscone South, Level 3

Standards

3:00 PM – 4:00 PM PDT

Japan Panel Level Packaging Panel FOUP Task Force Meeting [PIC]

Location: Moscone South, Level 3

Standards

3:10 PM – 3:40 PM PDT

FLEX Conference: Student Poster Networking Break

Location: Moscone South, Exhibition Level, Room 12

All-In PassStudent Explorer Pass

3:30 PM – 5:00 PM PDT

Daily Happy Hour

Location: Moscone North, Expo Floor, Beer and Wine Garden

3:40 PM – 5:00 PM PDT

FLEX Conference: Applications

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Session Chair: – IDTechEx

All-In PassStudent Explorer Pass

Sponsor

3:40 PM – 4:00 PM PDT

Transparent Heaters: The Evolution of a Product & the Benefit of Partnering

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Chasm Advanced Materials Inc

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4:00 PM – 4:20 PM PDT

Developments in Color ePaper for Flex Applications

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – E Ink Corporation

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4:20 PM – 4:40 PM PDT

Flexible Hybrid Electronics Enabling Wearable Human Sensing

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – AFRL

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4:40 PM – 5:00 PM PDT

Characterizing ink-jet nozzle performance for Printed Electronics using Gigahertz Ultrasonic Imager

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Geegah Inc.

All-In PassStudent Explorer Pass

3:40 PM – 5:00 PM PDT

FLEX Conference: Printing & Manufacturing

Location: Moscone South, Exhibition Level, Room 11

Session Chair: – NextFlex

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3:40 PM – 4:00 PM PDT

3D Printed Electronics with Multi Jet Fusion for Flexible Hybrid Electronics

Location: Moscone South, Exhibition Level, Room 11

Speaker: – HP Inc

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4:00 PM – 4:20 PM PDT

Direct-Write Additively Printed Electronics for RF Circuit Elements and Antennas

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Binghamton University

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4:20 PM – 4:40 PM PDT

Aerosol Printing for Semiconductor Packaging

Location: Moscone South, Exhibition Level, Room 11

Speaker: – IDS

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4:40 PM – 5:00 PM PDT

Additively Printed Formable Circuits for In-Mold Electronics on the Automotive Platform

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Auburn University

All-In PassStudent Explorer Pass

4:00 PM – 5:00 PM PDT

Fire Protection Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

4:00 PM – 5:00 PM PDT

SEMI Corporate Savings Program Wine and Cheese Mixer

Location: Moscone South, Level 2 Terrace

SEMI Members

4:00 PM – 5:00 PM PDT

SEMI E72 Revision Task Force Meeting [PIC]

Location: Moscone South, Level 3

Standards

4:00 PM – 5:00 PM PDT

SemiSisters Reception

Location: Moscone North, Expo Floor, Beer and Wine Garden

Sponsor

4:00 PM – 5:30 PM PDT

Fab & Equipment Computer and Device Security (CDS) Task Force Meeting [I&C]

Location: Moscone South, Level 3

Standards

5:00 PM – 6:00 PM PDT

S7 Revision Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

5:00 PM – 6:30 PM PDT

FLEX Reception

Location: Moscone South, Exhibition Level, Room 12

All-In PassStudent Explorer Pass

Sponsor

5:30 PM – 6:30 PM PDT

Climate Equity & Social Impact Networking

Location: Moscone South, Exhibition Level, Room 2, Sustainabilty Lounge

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6:00 PM – 7:30 PM PDT

SEMI Standards 50th Anniversary Celebration & Awards Ceremony

Location: Moscone South, Level 3

Standards

8:00 AM – 9:00 AM PDT

Environmental Performance Rating (EPR) Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

8:30 AM – 10:45 AM PDT

CEO Summit: Path to Net Zero

Location: Keynote Stage, Room 24, North Lower Lobby

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8:30 AM – 8:35 AM PDT

CEO Summit: Path to Net Zero Opening Remarks

Location: Keynote Stage, Room 24, North Lower Lobby

Session Moderator: – SEMI

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8:35 AM – 8:45 AM PDT

CEO Summit: Path to Net Zero Opening Remarks

Location: Keynote Stage, Room 24, North Lower Lobby

Speaker: – SEMI

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8:45 AM – 9:15 AM PDT

Keynote: Pursuing Sustainable Growth

Location: Keynote Stage, Room 24, North Lower Lobby

Keynote Speaker: – Intel Corporation

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9:15 AM – 9:45 AM PDT

Keynote: A Collaborative Pathway To Net Zero

Location: Keynote Stage, Room 24, North Lower Lobby

Keynote Speaker: – Applied Materials

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9:45 AM – 10:15 AM PDT

Keynote: Path to Net Zero-Showing Our True Colors: Co-Creating A Brighter Future For The Chip Industry

Location: Keynote Stage, Room 24, North Lower Lobby

Keynote Speaker: – Schneider Electric

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10:15 AM – 10:45 AM PDT

Keynote: Inventing What’s Next in Sustainable Computing

Location: Keynote Stage, Room 24, North Lower Lobby

Keynote Speaker: – IBM

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10:45 AM – 10:50 AM PDT

CEO Summit: Path to Net Zero Closing Remarks

Session Moderator: – SEMI

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10:45 AM – 10:55 AM PDT

SEMI Sustainability Hall of Fame

Location: Keynote Stage, Room 24, North Lower Lobby

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10:45 AM – 10:55 AM PDT

SEMI Sustainability Leadership Award – Semiconductor Climate Consortium

Location: Keynote Stage, Room 24, North Lower Lobby

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9:00 AM – 10:00 AM PDT

Global PIC Maintenance Task Force Meeting [PIC]

Location: Moscone South, Level 3

Standards

9:00 AM – 10:00 AM PDT

S8 (Ergonomics) Revision Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

9:00 AM – 5:00 PM PDT

Test Vision: Test Innovation Enables the Path Forward ( Day 1 of 2)

Location: Moscone South, Exhibition Level Room 9

All-In PassStudent Explorer Pass

9:00 AM – 9:10 AM PDT

Welcome Address and Opening Remarks

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – Teradyne

All-In PassStudent Explorer Pass

9:10 AM – 9:20 AM PDT

Test Vision - Program Chair Remarks

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – FormFactor

All-In PassStudent Explorer Pass

9:20 AM – 9:50 AM PDT

Best ATE Paper of 2022: Award and Presentation

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – Microsoft Corporation

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9:50 AM – 10:45 AM PDT

Keynote: Semiconductor Manufacturing Symbiosis

Location: Moscone South, Exhibition Level Room 9

Keynote Speaker: – Teradyne, Inc.

10:45 AM – 10:50 AM PDT

Session I Introduction

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – Reneasas

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10:50 AM – 11:15 AM PDT

High Performance Compute Devices and the Road to 2,000A

Location: Moscone South, Exhibition Level Room 9

Speaker: – Advantest Corporation

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11:15 AM – 11:40 AM PDT

Enhanced Parametric Test Insights Through Dynamic Data-Driven Test Flow Execution

Location: Moscone South, Exhibition Level Room 9

Speaker: – Advantest America

Co-Presenter: – PDF Solutions

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11:40 AM – 12:05 PM PDT

Experiences Building and Deploying Real-Time Data Infrastructure into Test Operations

Location: Moscone South, Exhibition Level Room 9

Speaker: – Advantest

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12:05 PM – 12:30 PM PDT

Best Practice for Handling Large Digital Content in Git Repositories

Location: Moscone South, Exhibition Level Room 9

Speaker: – Teradyne

Co-Presenter: – Teradyne

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1:25 PM – 1:30 PM PDT

Session II Introduction

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – Teradyne

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1:30 PM – 1:55 PM PDT

The Future is Here: GPT-4 as an Expert Assistant for Test and Product Engineers

Location: Moscone South, Exhibition Level Room 9

Speaker: – Advantest

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1:55 PM – 2:20 PM PDT

Quantum and CryoCMOS: Enabling the Future of Computing with Advanced Test & Measurement Tools

Location: Moscone South, Exhibition Level Room 9

Speaker: – FormFactor

Co-Presenter: – FormFactor

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2:20 PM – 2:45 PM PDT

Industry 4.0 Boosts Predictive Maintenance for Semiconductor Testers

Location: Moscone South, Exhibition Level Room 9

Speaker: – SPEA S.p.A.

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2:45 PM – 3:15 PM PDT

Embedding Analog Functionality into Protocol Testing Significantly Improves Debuggability

Location: Moscone South, Exhibition Level Room 9

Speaker: – Teradyne

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10:00 AM – 11:00 AM PDT

EMC Task Force Meeting [Metrics]

Location: Moscone South, Level 3

Standards

10:00 AM – 11:00 AM PDT

Flammable Gas Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

10:00 AM – 12:00 PM PDT

Physical Interfaces & Carriers (PIC) North America Technical Committee Chapter Meeting

Location: Moscone South, Level 3

Standards

10:00 AM – 5:00 PM PDT

VIP Lounge Open

Location: Moscone North, VIP Lounge

All-In PassThought Leadership Pass

10:30 AM – 12:30 PM PDT

Latest Trends in Sensorization

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

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10:30 AM – 10:40 AM PDT

Welcome Remarks and Session Overview

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – SEMI

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10:40 AM – 11:00 AM PDT

Addressing High Volume Manufacturing Challenges and Technology Inflections in MEMS

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Lam Research

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11:00 AM – 11:20 AM PDT

Pushing the Limits of MEMS Manufacturing

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – EV Group

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11:20 AM – 11:40 AM PDT

Trends in Emerging MEMS Technology

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – A.M. Fitzgerald & Associates

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11:40 AM – 12:00 PM PDT

0.56um-pitch CMOS Image Sensor for High Resolution Applications

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – OMNIVISION

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12:00 PM – 12:20 PM PDT

TMOS: Innovation in Presence and Motion Detection

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – STMicroelectronics

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12:20 PM – 12:30 PM PDT

Closing Remarks

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – SEMI

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10:30 AM – 12:30 PM PDT

Shortening the Learning Curve for Taiwan Companies in the United States

Location: Moscone South, Room 156, Mezzanine Level

Limited Space. RSVP Required

Sponsored By

10:30 AM – 10:45 AM PDT

Opening Remarks

Location: Moscone South, Room 156, Mezzanine Level

Limited Space. RSVP Required

10:45 AM – 10:55 AM PDT

Experiences, Challenges & Solutions in Investing in the United States

Location: Moscone South, Room 156, Mezzanine Level

Limited Space. RSVP Required

10:55 AM – 11:05 AM PDT

Achieving Uninterrupted Revenue Operations And Improved Working Capital Efficiency Through Strategic Vendor Managed Inventory

Location: Moscone South, Room 156, Mezzanine Level

Limited Space. RSVP Required

11:05 AM – 11:15 AM PDT

Introducing SSTEP Program

Location: Moscone South, Room 156, Mezzanine Level

Limited Space. RSVP Required

11:15 AM – 11:30 AM PDT

CHIPS Act Funding Update

Location: Moscone South, Room 156, Mezzanine Level

Limited Space. RSVP Required

11:30 AM – 11:45 AM PDT

Networking Break

Location: Moscone South, Room 156, Mezzanine Level

Limited Space. RSVP Required

11:45 AM – 12:30 PM PDT

Roundtable Discussion: Shortening the Learning Curve for Taiwan Companies in the United States

Location: Moscone South, Room 156, Mezzanine Level

Limited Space. RSVP Required

12:30 PM PDT

Closing Remarks

Location: Moscone South, Room 156, Mezzanine Level

Limited Space. RSVP Required

10:30 AM – 12:30 PM PDT

Meeting The Demands Of Affordable Electrification

Location: Smart Mobility Meet the Experts Theater

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10:30 AM – 10:35 AM PDT

Welcome Remarks and Session Overview

Location: Smart Mobility Meet the Experts Theater

Session Moderator: – Applied Materials

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10:35 AM – 11:00 AM PDT

Semiconductor Trends in Automotive

Location: Smart Mobilty Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Yole Group

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11:00 AM – 11:25 AM PDT

Electrification Trends: Balancing Efficiency and Affordability

Location: Smart Mobilty Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Infineon Technologies

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11:25 AM – 11:50 AM PDT

SiC – The key material to unlocking efficient and affordable electro-mobility?

Location: Smart Mobilty Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Robert Bosch GmbH

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11:50 AM – 12:40 PM PDT

Panel: How will Automotive OEMs make Electrification more Affordable?

Location: Smart Mobility Meet the Experts Theater

Panel Session Moderator: – Applied Materials

Panelist: – Robert Bosch GmbH

Panelist: – Infineon Technologies

Panelist: – Yole Group

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12:40 PM – 12:45 PM PDT

Closing Remarks

Location: Smart Mobility Meet the Experts Theater

Session Moderator: – Applied Materials

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10:30 AM – 1:00 PM PDT

Data Ecosystem

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

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10:30 AM – 10:35 AM PDT

Welcome Remarks and Session Introduction

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Session Moderator: – SEMI

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10:35 AM – 10:55 AM PDT

Scaling End-to-End Advanced Predictive Manufacturing

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – EMD Electronics

Speaker: – Micron

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10:55 AM – 11:15 AM PDT

Modernizing Semiconductor Data Platform Using AWS Cloud Solutions

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – GLOBALFOUNDRIES

Speaker: – AWS

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11:15 AM – 11:35 AM PDT

The Potential of the Smart Data Ecosystem for Semiconductor Capital Equipment

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Athinia Technologies LLC

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11:35 AM – 11:55 AM PDT

Navigating the Fab in the Metaverse

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Siemens

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11:55 AM – 12:15 PM PDT

Advanced Integration of Heterogenous System-Level Assemblies via Smart Manufacturing

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Jabil

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12:15 PM – 12:35 PM PDT

Minimizing the Time to Impactful Smart Manufacturing: a Platform Approach to Data Analytics

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Teradyne

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12:35 PM – 12:55 PM PDT

EcoTwin: An Integrated Solution for Sustainability in Semiconductor Manufacturing

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Applied Materials

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12:55 PM – 1:00 PM PDT

Closing Remarks

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Session Moderator: – SEMI

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11:00 AM – 11:25 AM PDT

Tales from Interns and Recent Graduates

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – Applied Materials

Speaker (WFD Pavilion): – EMD Electronics

Speaker (WFD Pavilion): – Lam Research

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11:30 AM – 11:55 AM PDT

Shaping a Better World Through Microelectronics

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – Lam Research

Speaker (WFD Pavilion): – University of Texas Austin

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12:00 PM – 12:25 PM PDT

Resume Building + Interviewing Skills

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – Nikon Precision Inc.

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1:30 PM – 1:55 PM PDT

Pitch Like a Pro: Landing a Job in Semiconductors

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – Edwards

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2:00 PM – 2:25 PM PDT

Opportunities from Failure – A Day in the Life of an Engineer

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – Applied Materials

Speaker (WFD Pavilion): – Lam Research

Speaker (WFD Pavilion): – TEL

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2:30 PM – 3:25 PM PDT

PANEL: Innovative Approaches and Best Practices for Preparing and Expanding the U.S. Semiconductor Workforce

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Panel Session Moderator (WFD Session): – Pasadena City College/MNT-EC

Panelist (WFD Session): – Newberry Technology Associates

Panelist (WFD Session): – Micro Nano Technology Education Center

Panelist (WFD Session): – Portland Community College

Panelist (WFD Session): – Manufacturing Engineering Program, University of New Mexico

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10:45 AM – 12:45 PM PDT

FLEX Conference: Future FLEX Disruptors

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

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Sponsor

10:45 AM – 10:55 AM PDT

Welcome to Future FLEX Disruptors

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Moderator: – Chasm Advanced Materials Inc

Moderator: – E Ink

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10:55 AM – 11:00 AM PDT

Startup: Arieca -- Liquid Metal Embedded Elastomers for a next generation Thermal Interface Materials

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Arieca Inc

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11:00 AM – 11:05 AM PDT

ESTAT Actuation: Flexible Electronics Make Lightweight Clutches Possible

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – ESTAT Actuation

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11:05 AM – 11:10 AM PDT

The Dry Multimaterial Printing Technology that Transforms the Way Electronics are Printed

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Auburn University/NanoPrintek, Inc.

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11:10 AM – 11:15 AM PDT

Scalable Fiber to the Chip Connectivity

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – ICON Photonics

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11:15 AM – 11:20 AM PDT

Disruptive, Proven Interconnects for Flexible Electronics

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – SunRay Scientific Inc.

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11:20 AM – 11:25 AM PDT

Stretching the Boundaries: Innovative Approaches to Flexible and Stretchable Electronics Packaging

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Liquid Wire Inc.

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11:25 AM – 12:40 PM PDT

Startup/VC Panel Discussion

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Moderator: – Chasm Advanced Materials Inc

Moderator: – E Ink

Panelist: – Chemical Angels Network

Panelist: – Henkel Tech Ventures

Panelist: – Phoenix Venture Partners

Panelist: – Arieca Inc

Panelist: – ESTAT Actuation

Panelist: – Auburn University/NanoPrintek, Inc.

Panelist: – ICON Photonics

Panelist: – SunRay Scientific Inc.

Panelist: – Liquid Wire Inc.

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12:40 PM – 12:45 PM PDT

Closing Remarks

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Moderator: – Chasm Advanced Materials Inc

Moderator: – E Ink

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11:00 AM – 12:00 PM PDT

Bulls and Bears

Location: Keynote Stage, Room 24, North Lower Lobby

Panel Session Moderator:

Panelist: – Jefferies

Panelist: – Tudor Investment Corporation

Panelist: – Parnassus Investments

Panelist: – Bernstein Research

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11:00 AM – 12:00 PM PDT

S10 Revision Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

11:30 AM – 3:30 PM PDT

Food Trucks Open

Location: Moscone North, Hall F

11:30 AM – 3:30 PM PDT

Taste of San Francisco Lunch: Mission Day

Location: Moscone South, Expo Hall

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1:00 PM – 2:00 PM PDT

S12 (Equip Decon) Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

1:00 PM – 3:30 PM PDT

America's Path Forward In Semiconductors, A SEMICON West Session On Government and the Semiconductor Industry

Location: Keynote Stage, Room 24, North Lower Lobby

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Sponsor

1:00 PM – 1:05 PM PDT

Welcome Remarks

Location: Keynote Stage, Room 24, North Lower Lobby

Speaker: – SEMI

1:05 PM – 1:15 PM PDT

The Need for Domestic Semiconductor Manufacturing

Location: Keynote Stage, Room 24, North Lower Lobby

1:15 PM – 1:40 PM PDT

The Path Forward on Export Controls

Location: Keynote Stage, Room 24, North Lower Lobby

Speaker: – Covington & Burling

1:40 PM – 1:50 PM PDT

The Making of the CHIPS Act

Location: Keynote Stage, Room 24, North Lower Lobby

1:50 PM – 2:15 PM PDT

CHIPS Act Update

Location: Keynote Stage, Room 24, North Lower Lobby

Speaker: – U.S. Department of Commerce

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2:15 PM – 3:15 PM PDT

Panel Discussion: The Whole of Government Approach to Supporting CHIPS Investment

Location: Keynote Stage, Room 24, North Lower Lobby

Panel Session Moderator: – Boston Consulting Group (BCG)

Panelist: – State of Indiana

Panelist: – U.S. Department of Commerce

Panelist: – mySilicon Compass

Panelist: – BDO USA

Panelist: – Arizona Commerce Authority.

3:15 PM – 3:25 PM PDT

Closing Video by The Honorable Ro Khanna, U.S. Representative from California

Location: Keynote Stage, Room 24, North Lower Lobby

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3:25 PM – 3:30 PM PDT

Closing Remarks

Location: Keynote Stage, Room 24, North Lower Lobby

Session Moderator: – SEMI

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1:00 PM – 4:00 PM PDT

Liquid Chemicals North America Technical Committee Chapter Meeting - Day 2

Location: Moscone South, Level 3

Standards

1:00 PM – 5:00 PM PDT

Global Cybersecurity Forum: Securing The Future For Semiconductor Manufacturing

Location: Moscone North, Exhibition Level, Room 21

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Sponsor

1:00 PM – 1:05 PM PDT

Cybersecurity Forum Introduction and Welcome Remarks

Location: Moscone North, Exhibition Level, Room 21

Session Moderator: – PEER Group

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1:05 PM – 1:50 PM PDT

Securing our Global Manufacturing Supply Chain

Location: Moscone North, Exhibition Level, Room 21

Keynote Speaker: – Intel Corporation

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1:50 PM – 2:20 PM PDT

Cybersecurity Forum Keynote: Securing the Supply Chain

Location: Moscone North, Exhibition Level, Room 21

Keynote Speaker: – TSMC

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2:20 PM – 2:40 PM PDT

NIST Cybersecurity Resources for Semiconductor Manufacturing

Location: Moscone North, Exhibition Level, Room 21

Speaker: – National Institute of Standards and Technology (NIST)

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2:50 PM – 3:05 PM PDT

SEMI E187 & E188: A Standard Defensive Strategy for Fabs

Location: Moscone North, Exhibition Level, Room 21

Speaker: – PEER Group

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3:05 PM – 3:25 PM PDT

Creating a Cyber Resilient Semi Industry Together

Location: Moscone North, Exhibition Level, Room 21

Speaker: – Applied Materials

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3:25 PM – 3:45 PM PDT

It's Better to Trust Each Other

Location: Moscone North, Exhibition Level, Room 21

Speaker: – Lam Research

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3:45 PM – 4:05 PM PDT

Collective Cyber Defense to protect the Semiconductor Industry

Location: Moscone North, Exhibition Level, Room 21

Speaker: – ASML

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4:05 PM – 4:45 PM PDT

Panel: Accelerating Cybersecurity Initiatives

Location: Moscone North, Exhibition Level, Room 21

Panel Session Moderator: – PEER Group

Panelist: – ASML

Panelist: – Lam Research

Panelist: – TSMC

Panelist: – Intel Corporation

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4:45 PM – 5:00 PM PDT

Closing Remarks

Speaker: – Intel Corporation

1:00 PM – 5:20 PM PDT

Sustainability & EHS Forum

Location: Moscone North, Exhibition Level, Room 20-21

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Sponsors

1:00 PM – 1:10 PM PDT

Welcome Remarks

Location: Moscone North, Exhibition Level, Room 20-21

Session Moderator: – SEMI

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1:10 PM – 1:35 PM PDT

Environmental Regulatory Update -- EU, US EPA, and Global Developments

Location: Moscone North, Exhibition Level, Room 20-21

Speaker: – Beveridge & Diamond

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1:35 PM – 2:00 PM PDT

US State Level PFAS Legislation

Location: Moscone North, Exhibition Level, Room 20-21

Speaker: – SPAN

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2:00 PM – 2:30 PM PDT

Semi-Industry Sustainability Collaboration & Prioritization

Location: Moscone North, Exhibition Level, Room 20-21

Speaker: – Intel

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2:30 PM – 2:55 PM PDT

SEMI PFAS WG Focus on Equipment and Articles

Location: Moscone North, Exhibition Level, Room 20-21

Speaker: – Applied Materials

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2:55 PM – 3:20 PM PDT

Accelerating the R&D of Measurement, Abatement, and Alternatives

Location: Moscone North, Exhibition Level, Room 20-21

Speaker: – Semiconductor Research Corporation (SRC)

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3:20 PM – 3:30 PM PDT

How do we eat the PFAS elephant……

Location: Moscone North, Exhibition Level, Room 20-21

Speaker: – inemi

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3:30 PM – 3:50 PM PDT

Panel Discussion and Wrap-up

Location: Moscone North, Exhibition Level, Room 20-21

Panel Session Moderator: – SEMI

Panelist: – Applied Materials

Panelist: – Beveridge & Diamond

Panelist: – Intel

Panelist: – SPAN

Panelist: – Semiconductor Research Corporation (SRC)

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4:00 PM – 4:45 PM PDT

Panel: Financial Incentives & Disclosures: The ESG Landscape

Location: Moscone North, Exhibition Level, Room 20-21

Panel Session Moderator: – McKinsey & Co.

Panelist: – Kirkland & Ellis LLP

Panelist: – Ajax Strategies

Panelist: – McKinsey

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4:45 PM – 5:15 PM PDT

Fireside Chat

Location: Moscone North, Exhibition Level, Room 20-21

Moderator: – SEMI

Panelist: – Stockholm Environment Institute

Panelist: – Clean Air Fund

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5:15 PM – 5:20 PM PDT

Closing Remarks

Location: Moscone North, Exhibition Level, Room 20-21

Session Moderator: – SEMI

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1:15 PM – 1:45 PM PDT

Applied Materials / ASU Press Briefing (Invitation Only)

Location: Moscone South, Exhibition Level, Room 2

1:30 PM – 3:00 PM PDT

RF Measurements Task Force Meeting [Metrics]

Location: Moscone South, Level 3

Standards

1:30 PM – 3:10 PM PDT

FLEX Conference: Materials & Components

Location: Moscone South, Exhibition Level, Room 11

Session Chair: – Heraeus Electronics

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Sponsor

1:30 PM – 1:50 PM PDT

ELMNT® Ink – Development, Prototyping, and Beyond

Location: Moscone South, Exhibition Level, Room 11

Co-Presenter: – UES, Inc.

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1:50 PM – 2:10 PM PDT

Application of Conductive Composite Layers to Various Types of Printable Sensors

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Yamagata University

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2:10 PM – 2:30 PM PDT

Synthesis of Ti3C2Tx nonmaterial Ink for Additive Manufacturing of Energy Storage Devices

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Boise State University

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2:30 PM – 2:50 PM PDT

The Latest material technology to support power module packaging

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Sumitomo Bakelite Co., LTD. / Information & Telecommunication Materials Research Laboratory

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2:50 PM – 3:10 PM PDT

Compliant Electronic Interconnect for Ultrafine Pitch Die-to-Die Bonding

Location: Moscone South, Exhibition Level, Room 11

Speaker: – SunRay Scientific Inc.

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1:30 PM – 3:10 PM PDT

FLEX Conference: Strategy & Business II

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Session Chair: – Eastman Kodak Company

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Sponsor

1:30 PM – 1:50 PM PDT

Advancement of PEEMS Technologies for Future Weapons and Armaments

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – US Army DEVCOM - Armaments Center

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1:50 PM – 2:10 PM PDT

Lessons Learned in Roll-to-Part Manufacturing of Consumer Electronics

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Kent Displays Technical Services

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2:10 PM – 2:30 PM PDT

From Lab to Scale: Designing with Manufacturing in Mind

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Tapecon

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2:30 PM – 2:50 PM PDT

Real Printed Electronics Applications: Past, Present, and Future

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – TechBlick

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2:50 PM – 3:10 PM PDT

A Survey of Emerging Challenges and Technical Needs to Advance High Mix Semiconductor Manufacturing

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – University of Cincinnati

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2:00 PM – 2:30 PM PDT

Best of West: Echo Opto-Acoustic Metrology System Presented by Onto Innovation

Location: Best of West Stage

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2:00 PM – 2:30 PM PDT

S3 (Heating Systems) Revision Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

2:00 PM – 4:15 PM PDT

Intelligent Sensors for Smart Mobility

Location: Smart Mobility Meet the Experts Theater

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2:00 PM – 2:05 PM PDT

Welcome Remarks and Session Overview

Location: Smart Mobility Meet the Experts Theater

Session Moderator: – Applied Materials

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2:05 PM – 2:30 PM PDT

Next-Generation Automotive Demands and Trends

Location: Smart Mobilty Theater, Moscone South, Exhibition Level, Hall C

Speaker: – McKinsey & Company

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2:30 PM – 2:55 PM PDT

Smart Mobility Uniting Man & Machine

Location: Smart Mobilty Theater, Moscone South, Exhibition Level, Hall C

Speaker: – DENSO International America

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2:55 PM – 3:20 PM PDT

Enhanced Pedestrian Safety with 3D Thermal Ranging using AI for ADAS/AV Applications

Location: Smart Mobility Meet the Experts Theater

Speaker: – Owl Autonomous Imaging

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3:20 PM – 4:10 PM PDT

Panel: How will Future Mobility Platforms be Defined by Software?

Location: Smart Mobilty Theater, Moscone South, Exhibition Level, Hall C

Panel Session Moderator: – Applied Materials

Panelist: – DENSO International America

Panelist: – McKinsey & Company

Panelist: – Owl Autonomous Imaging

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4:10 PM – 4:15 PM PDT

Closing Remarks

Location: Smart Mobility Meet the Experts Theater

Session Moderator: – Applied Materials

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2:00 PM – 4:30 PM PDT

AI/ML Enabled Manufacturing Operations

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

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2:00 PM – 2:05 PM PDT

Welcome Remarks and Session Introduction

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Session Moderator: – PDF Solutions

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2:05 PM – 2:25 PM PDT

Smart Manufacturing Process Control: Yield Diagnostics and Prediction with ML-based Techniques

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Samsung

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2:25 PM – 2:45 PM PDT

Improving Throughput in Semiconductor Fabs Through a Novel Unsupervised Machine Learning Method

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Galaxy Semiconductor

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2:45 PM – 3:05 PM PDT

Enabling Smart Manufacturing in Semiconductor Fabs Using Predictive Design and Process Insights

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Siemens EDA

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3:05 PM – 3:25 PM PDT

Applying Generative AI for Competitiveness in Semiconductor Manufacturing

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Aitomatic

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3:25 PM – 3:45 PM PDT

Machine Learning Improves Final Test Forecast for Semiconductor Fabs

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – ONTO INNOVATION

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3:45 PM – 4:05 PM PDT

Virtual Metrology: From Pipe Dream to Reality

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Gauss Labs

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4:05 PM – 4:25 PM PDT

How to Use AI for Sustainability to Win in the New ESG Economy

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Rockwell Automation

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4:25 PM – 4:30 PM PDT

Closing Remarks

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Session Moderator: – PDF Solutions

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2:00 PM – 5:00 PM PDT

Heterogeneous Integration: HPC and Hyperscale Computing

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

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Sponsor

2:00 PM – 2:10 PM PDT

Session Welcome Remarks and Agenda review

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Session Moderator: – Heterogeneous Integration Roadmap, IEEE EPS

Session Moderator: – Intel

Session Moderator: – Lawrence Berkeley National Laboratory / Applied Mathematics and Computational Science / Department of Energy

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2:10 PM – 2:40 PM PDT

Aurora - Argonne’s First Exascale Supercomputer

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Argonne Leadership Computing Facility

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2:40 PM – 3:10 PM PDT

Heterogeneous Integration Process Development and its Challenges

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Intel

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3:20 PM – 4:40 PM PDT

Heterogeneous Integration: HPC and Hyperscale Computing Panel Discussion/ Q&A from Audience:

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Panel Session Moderator: – Lawrence Berkeley National Laboratory / Applied Mathematics and Computational Science / Department of Energy

Panelist: – Ayar Labs

Panelist: – Lightmatter

Panelist: – Open Compute Project Foundation

Panelist: – UT Arlington

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4:40 PM – 5:00 PM PDT

Closing Remarks

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Session Moderator: – Heterogeneous Integration Roadmap, IEEE EPS

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2:30 PM – 3:30 PM PDT

S2 Major Revision Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

3:10 PM – 3:40 PM PDT

FLEX Conference: Student Poster Networking Break

All-In PassStudent Explorer Pass

3:40 PM – 5:00 PM PDT

Test Vision Reception

Location: Moscone South, Exhibition Level Room 10

All-In PassStudent Explorer Pass

3:30 PM – 4:30 PM PDT

Manufacturing Equipment Safety Subcommittee (MESSC) Meeting

Location: Moscone South, Level 3

Standards

3:30 PM – 5:00 PM PDT

Daily Happy Hour

Location: Moscone North, Expo Floor, Beer and Wine Garden

3:30 PM – 5:30 PM PDT

Metrics North America Technical Committee Chapter Meeting

Location: Moscone South, Level 3

Standards

3:40 PM – 5:20 PM PDT

FLEX Conference: FHE for Human Interface & Soft Robotics

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Session Chair: – US Air Force Research Laboratory

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3:40 PM – 4:00 PM PDT

Flexible electronics integrated into textiles

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – NextFlex

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4:00 PM – 4:20 PM PDT

Towards Untethered Soft Robotics for Industrial Inspection: Challenges and Possibilities

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – GE Research

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4:20 PM – 4:40 PM PDT

Mobile Application for Muscle Function Management Solution Using sEMG and Strain Sensors

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – SMDsolutions

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4:40 PM – 5:00 PM PDT

Locomoting Modular Soft Robotic Systems based on Electrostatic Actuators and Flexible Electronics

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – University of Colorado Boulder

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5:00 PM – 5:20 PM PDT

Printed Stretchable Electronics and Sensors for a Glove and Sleeve Human-Machine Interface

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Worcester Polytechnic Institute

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3:40 PM – 5:00 PM PDT

FLEX Conference: Manufacturing Challenges

Location: Moscone South, Exhibition Level, Room 11

Session Chair: – Binghamton University, State University of New York

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3:40 PM – 4:00 PM PDT

Patterning sputtered coatings with Lasers of 2D multilayer electronic sensors for volume production

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Intellivation LLC

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4:00 PM – 4:20 PM PDT

A modular R2R vacuum coating platform for productivity in multi-layer applications

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Bühler Alzenau GmbH, Leybold Optics

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4:20 PM – 4:40 PM PDT

Improving Worker Safety with FHE-enabled Wearable Sensors

Location: Moscone South, Exhibition Level, Room 11

Speaker: – NextFlex

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4:40 PM – 5:00 PM PDT

Methods to Improve FHE Productivity and Yield

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Komori America

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4:30 PM – 5:30 PM PDT

EHS Leadership Meeting

Location: Moscone South, Level 3

Standards

4:30 PM – 6:00 PM PDT

Smart Manufacturing Reception

Location: Smart Manufacturing Meet the Experts Theater, Moscone North, Exhibition Level, Hall F

Student Explorer Pass

4:30 PM – 6:00 PM PDT

Smart Mobility Reception

Location: Moscone South, Exhibition Level, Smart Pavilion

Student Explorer Pass

4:30 PM – 6:00 PM PDT

Workforce Development Reception

Location: Workforce Development Pavilion, Moscone North, Exhibition Level, Hall F

Student Explorer Pass

Sponsor

5:00 PM – 6:00 PM PDT

Advanced Packaging & Heterogeneous Integration Reception

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Student Explorer Pass

Sponsors

5:30 PM – 6:30 PM PDT

S2 / S22 Task Force Meeting [EHS]

Location: Moscone South, Level 3

Standards

5:30 PM – 6:30 PM PDT

Sustainability & EHS Forum Reception

Location: Moscone North, Exhibition Level, Room 20

Thought Leadership PassAll-In PassStudent Explorer Pass

Sponsors

5:30 PM – 7:30 PM PDT

MSIG (MEMS and Sensors Industry Group) Reception

Location: Moscone South, Level 3, Terrace

Student Explorer Pass

Sponsored By

10:30 AM – 4:30 PM PDT

Building a Career in Microelectronics

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Expo PassExpo Plus PassThought Leadership PassAll-In PassStudent Explorer Pass

3:15 PM – 5:00 PM PDT

Test Vision Poster Presentation

Location: Moscone South, Exhibition Level Room 9

All-In PassStudent Explorer Pass

10:30 AM – 10:55 AM PDT

A Day in a Life of an Engineer

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – DuPont

Speaker (WFD Pavilion): – EMD Electronics

Speaker (WFD Pavilion): – Synopsys

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3:15 PM – 3:20 PM PDT

Poster Presentation Introduction

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – FormFactor

All-In PassStudent Explorer Pass

3:30 PM – 4:30 PM PDT

Flash Mentoring Session for Students (Sign-up Required)

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

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3:15 PM – 5:00 PM PDT

Application Specific Solutions To Address Today’s Test Challenges

Location: Moscone South, Exhibition Level Room 9

Poster Presenter: – AEM Holdings Ltd

Poster Presenter: – AEM

Poster Presenter: – UTAC

All-In PassStudent Explorer Pass

3:15 PM – 5:00 PM PDT

Deploying a MATLAB Application onto the ACS Real-Time Data Infrastructure

Location: Moscone South, Exhibition Level Room 9

Poster Presenter: – Advantest

All-In PassStudent Explorer Pass

3:15 PM – 5:00 PM PDT

Electromagnetic Interference – Overcoming Challenges for Semiconductor and Electronics Manufacturing

Location: Moscone South, Exhibition Level Room 9

Poster Presenter: – OnFILTER

All-In PassStudent Explorer Pass

3:15 PM – 5:00 PM PDT

Extreme Temperature Automotive Testing

Location: Moscone South, Exhibition Level Room 9

Poster Presenter: – Teradyne

All-In PassStudent Explorer Pass

3:15 PM – 5:00 PM PDT

Interactive Protocol Analyzer for Digital Protocol Signal Validation

Location: Moscone South, Exhibition Level Room 9

Poster Presenter: – Soliton Technologies Private Limited

Poster Presenter: – Soliton

All-In PassStudent Explorer Pass

3:15 PM – 5:00 PM PDT

Realtime Deep Data Adaptive Testing for Die-to-Die Interfaces

Location: Moscone South, Exhibition Level Room 9

Poster Presenter: – ProteanTecs

All-In PassStudent Explorer Pass

3:15 PM – 5:00 PM PDT

Reducing Cost of Test - Innovating the Future of Test through ATE specific ICs

Location: Moscone South, Exhibition Level Room 9

Poster Presenter: – Elevate Semi

All-In PassStudent Explorer Pass

3:15 PM – 5:00 PM PDT

Requirements Driven Semiconductor Verification

Location: Moscone South, Exhibition Level Room 9

Poster Presenter: – Dassault Systemes

All-In PassStudent Explorer Pass

3:15 PM – 5:00 PM PDT

Terahertz ATE Vision 2030

Location: Moscone South, Exhibition Level Room 9

Poster Presenter: – Eastern Institute for Advanced Study

All-In PassStudent Explorer Pass

3:15 PM – 5:00 PM PDT

The Dynamic Characteristics of an 1700 V 50 A 4H-SiC MOSFET via a Double Pulse Test

Location: Moscone South, Exhibition Level Room 9

Poster Presenter: – National Taiwan University

All-In PassStudent Explorer Pass

8:30 AM – 11:30 AM PDT

CEO Summit Path for Talent

Location: Keynote Stage, Room 24, North Lower Lobby

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8:30 AM – 8:40 AM PDT

CEO Summit: Path for Talent Welcome Remarks

Location: Keynote Stage, Room 24, North Lower Lobby

Speaker: – SEMI

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8:40 AM – 8:45 AM PDT

CEO Summit: Path for Talent Opening Remarks

Location: Keynote Stage, Room 24, North Lower Lobby

Speaker: – SEMI Foundation

Expo Plus PassThought Leadership PassAll-In PassStudent Explorer Pass

8:45 AM – 9:15 AM PDT

Keynote: One Trillion Reasons to Join our Industry

Location: Keynote Stage, Room 24, North Lower Lobby

Keynote Speaker: – Axcelis Technologies

Expo Plus PassThought Leadership PassAll-In PassStudent Explorer Pass

9:15 AM – 9:45 AM PDT

Keynote: Building the Future: Workforce Development in the Semiconductor Manufacturing Industry

Location: Keynote Stage, Room 24, North Lower Lobby

Keynote Speaker: – SkyWater Technology

Expo Plus PassThought Leadership PassAll-In PassStudent Explorer Pass

9:45 AM – 10:15 AM PDT

Keynote: Transforming Pathways To Transformative Semiconductor Careers

Location: Keynote Stage, Room 24, North Lower Lobby

Keynote Speaker: – University of California, Berkeley

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10:15 AM – 10:20 AM PDT

Announcement of 20 Under 30 Award Recipients

Location: Keynote Stage, Room 24, North Lower Lobby

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10:20 AM – 10:30 AM PDT

Presentation of the SEMI Foundation Excellence in Achievement Award by EMD Electronics

Location: Keynote Stage, Room 24, North Lower Lobby

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10:30 AM – 11:30 AM PDT

"Chip In"– Roadtrip Nation Panel

Location: Keynote Stage, Room 24, North Lower Lobby

Speaker: – Roadtrip Nation

Panel Session Moderator: – SEMI Foundation

Panelist: – University of Texas Austin

Panelist: – Accenture

Panelist: – Aeris LLC

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8:30 AM – 4:00 PM PDT

SOI Markets & Technology Symposium

Location: Moscone North, Exhibition Level, Room 20

All-In PassStudent Explorer Pass

Sponsored By

8:30 AM – 8:45 AM PDT

Welcome Remarks and Symposium Overview

Location: Moscone North, Exhibition Level, Room 20

Session Moderator: – Soitec

All-In PassStudent Explorer Pass

8:45 AM – 9:15 AM PDT

SOI Market Trends and Potential Applications

Location: Moscone North, Exhibition Level, Room 20

Speaker: – Yole Group

All-In PassStudent Explorer Pass

9:15 AM – 9:45 AM PDT

SOI for Markets that Matter

Location: Moscone North, Exhibition Level, Room 20

Speaker: – GlobalFoundries

All-In PassStudent Explorer Pass

9:45 AM – 10:15 AM PDT

Engineered Substrates for Best PPAC: SOI chapter

Location: Moscone North, Exhibition Level, Room 20

Speaker: – Soitec

All-In PassStudent Explorer Pass

10:35 AM – 10:55 AM PDT

It takes an ecosystem to enable a process

Location: Moscone North, Exhibition Level, Room 20

Speaker: – Synopsys

All-In PassStudent Explorer Pass

10:55 AM – 11:15 AM PDT

Future Needs and Solutions

Location: Moscone North, Exhibition Level, Room 20

Speaker: – CEA-Leti

All-In PassStudent Explorer Pass

11:15 AM – 11:35 AM PDT

RF-SOI for SATCOM, 5G and 6G: The Ideal Process

Location: Moscone North, Exhibition Level, Room 20

Speaker: – UCSD

All-In PassStudent Explorer Pass

11:35 AM – 12:00 PM PDT

Characterization Challenges for Future RF Materials

Location: Moscone North, Exhibition Level, Room 20

Speaker: – Incize

All-In PassStudent Explorer Pass

1:30 PM – 2:00 PM PDT

FDSOI for Automotive Processors: The i.MX8 Family

Location: Moscone North, Exhibition Level, Room 20

Speaker: – NXP Semiconductors

All-In PassStudent Explorer Pass

2:00 PM – 2:20 PM PDT

28nm FDSOI Stellar MCUs: More Performance, Less Energy Toward a Sustainable Future

Location: Moscone North, Exhibition Level, Room 20

Speaker: – STMicroelectronics

All-In PassStudent Explorer Pass

2:40 PM – 3:00 PM PDT

FDSOI Adaptive and Versatile IoT Node for Energy Efficient Local AI Processing

Location: Moscone North, Exhibition Level, Room 20

Speaker: – CEA-Leti-LIST

All-In PassStudent Explorer Pass

3:00 PM – 3:20 PM PDT

Enabling Power Efficient Design Using Synopsys Foundation IP for GlobalFoundries 22FDX® & 22FDX+™ Processes

Location: Moscone North, Exhibition Level, Room 20

Speaker: – Synopsys

All-In PassStudent Explorer Pass

3:20 PM – 3:40 PM PDT

Dolphin Design: ABB Solution to Optimize the Magic of SOI Technologies

Location: Moscone North, Exhibition Level, Room 20

Speaker: – Dolphin Design

All-In PassStudent Explorer Pass

3:40 PM – 4:00 PM PDT

Advanced SOI Radar Sensors for Human Motion Detection

Location: Moscone North, Exhibition Level, Room 20

Speaker: – GlobalFoundries

All-In PassStudent Explorer Pass

9:00 AM – 3:00 PM PDT

Environmental, Health & Safety (EHS) North America Technical Committee Chapter Meeting

Location: Moscone South, Level 3

Standards

9:00 AM – 3:00 PM PDT

Information & Control North America Technical Committee Chapter Meeting

Location: Moscone South, Level 3

Standards

9:00 AM – 5:00 PM PDT

Test Vision: Test Innovation Enables the Path Forward ( Day 2 of 2)

Location: Moscone South, Exhibition Level Room 9

All-In PassStudent Explorer Pass

9:00 AM – 9:05 AM PDT

Opening Remarks

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – Teradyne

All-In PassStudent Explorer Pass

9:10 AM – 9:55 AM PDT

Heterogeneous Integration Paving the way for Microelectronics Resurgence

Location: Moscone South, Exhibition Level Room 9

Keynote Speaker: – Heterogeneous Integration Roadmap, IEEE EPS

All-In PassStudent Explorer Pass

9:55 AM – 10:00 AM PDT

Session III: Introduction

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – Advantest America Inc.

All-In PassStudent Explorer Pass

10:00 AM – 10:25 AM PDT

Production Test RF Calibration Methods for Probe Cards

Location: Moscone South, Exhibition Level Room 9

Speaker: – FormFactor

All-In PassStudent Explorer Pass

10:25 AM – 10:50 AM PDT

ATE Latch-up Testing of Real World, High Power Devices

Location: Moscone South, Exhibition Level Room 9

Speaker: – ISE Labs, Inc.

All-In PassStudent Explorer Pass

10:50 AM – 11:15 AM PDT

Getting the Straight Story: Approaches to Linearity Measurements for ADCs

Location: Moscone South, Exhibition Level Room 9

Speaker: – National Instruments

All-In PassStudent Explorer Pass

11:40 AM – 12:05 PM PDT

Emerging PMIC Trends Demand Test Innovations

Location: Moscone South, Exhibition Level Room 9

Speaker: – Teradyne

All-In PassStudent Explorer Pass

12:05 PM – 12:30 PM PDT

Test Vision - Program Chair Remarks

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – Advantest

All-In PassStudent Explorer Pass

1:00 PM – 1:55 PM PDT

CHIPS Act Implementation: Past, Present, and Future - mySilicon Compass

Location: Moscone South, Exhibition Level Room 9

Keynote Speaker: – mySilicon Compass

All-In PassStudent Explorer Pass

1:55 PM – 2:00 PM PDT

Session IV: Introduction

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – AEM

All-In PassStudent Explorer Pass

2:00 PM – 2:25 PM PDT

HVM test of UCIe-enabled chiplets for 2.5D and 3D devices: The case for a dedicated test port

Location: Moscone South, Exhibition Level Room 9

Speaker: – Advantest Europe GmbH

All-In PassStudent Explorer Pass

2:25 PM – 2:50 PM PDT

Advancing Probe Card Parallelism for SOC Devices

Location: Moscone South, Exhibition Level Room 9

Speaker: – FormFactor

All-In PassStudent Explorer Pass

2:50 PM – 3:15 PM PDT

Mixed-Signal Test Workforce Development - An analysis of the Test Program at Texas A&M University

Location: Moscone South, Exhibition Level Room 9

Speaker: – Texas A&M University

Speaker: – Texas A & M

All-In PassStudent Explorer Pass

3:15 PM – 3:40 PM PDT

Enabling Comprehensive, ATE Class, High-performance Protocol Validation on the Bench

Location: Moscone South, Exhibition Level Room 9

Speaker: – Soliton Technologies Private Limited

Speaker: – Soliton Technologies

All-In PassStudent Explorer Pass

3:40 PM – 4:50 PM PDT

Panel Discussion: From Assembly Line to Field: The Future Semiconductor Testing

Location: Moscone South, Exhibition Level Room 9

Panel Session Moderator: – semiengineering.com

Panelist: – Archon Design Solutions, Inc.

Panelist: – Intel

Panelist: – PDF Solutions

Panelist: – proteanTecs

All-In PassStudent Explorer Pass

4:50 PM – 4:55 PM PDT

Symposium Raffle and Winner Announcement

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – Advantest America

All-In PassStudent Explorer Pass

4:55 PM – 5:00 PM PDT

Closing Remarks

Location: Moscone South, Exhibition Level Room 9

Session Moderator: – Teradyne

All-In PassStudent Explorer Pass

10:00 AM – 10:30 AM PDT

FLEX Conference: FLEXI Awards and Student Poster Awards Ceremony

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Session Chair: – SEMI

All-In PassStudent Explorer Pass

10:00 AM – 4:00 PM PDT

VIP Lounge Open

Location: Moscone North, VIP Lounge

All-In PassThought Leadership Pass

10:30 AM – 11:55 AM PDT

FLEXTalks

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Expo PassExpo Plus PassThought Leadership PassAll-In PassStudent Explorer Pass

10:30 AM – 10:40 AM PDT

Aerosol Printing for Vertical Interconnects and Non-Planar Printing

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – IDS

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10:45 AM – 10:55 AM PDT

Silver Powders and Flakes for Flex/IME Applications

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Presenter: – Metalor

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11:00 AM – 11:10 AM PDT

Cost Effective Flexible Electronics Solutions

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Presenter: – Tapecon

Expo PassExpo Plus PassThought Leadership PassAll-In PassStudent Explorer Pass

11:15 AM – 11:25 AM PDT

Innovative Portfolio of FHE Technology

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – NexTex Ventures (NTVUSA)

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11:30 AM – 11:40 AM PDT

Flexible Electronics: Quantifying Liquid Metal Adhesion by Contact Angle & Adhesive Force Measurements

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – DataPhysics Instruments USA Corp.

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11:45 AM – 11:55 AM PDT

Printing Traces with Gravure Offset

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Komori America

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10:30 AM – 12:10 PM PDT

FLEX Conference: Advanced Packaging

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Session Chair: – Binghamton University, State University of New York

All-In PassStudent Explorer Pass

10:30 AM – 10:50 AM PDT

Resonac’s Open Innovation at Advanced Package

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Resonac

All-In PassStudent Explorer Pass

10:50 AM – 11:10 AM PDT

Pick and Place Parameter Optimization for Tacky Device Carriers

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Gel-Pak

All-In PassStudent Explorer Pass

11:10 AM – 11:30 AM PDT

Additively Manufactured Flexible “Smart” Packaging and On-Package Antennas for 5G/mmWave Systems

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Georgia Institute of Technology

All-In PassStudent Explorer Pass

11:30 AM – 11:50 AM PDT

Development and Validation of The Flexible Package Technology on EMG Sensor Based Smart System

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Industrial Technology Research Institute

All-In PassStudent Explorer Pass

11:50 AM – 12:10 PM PDT

Assembly Solutions for Cost-Effective Heterogeneous Integration with Disparate Die Types

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Universal Instruments

All-In PassStudent Explorer Pass

10:30 AM – 12:10 PM PDT

FLEX Conference: Manufacturing & Reliability

Location: Moscone South, Exhibition Level, Room 11

Session Chair: – Bayflex Solutions

All-In PassStudent Explorer Pass

10:30 AM – 10:50 AM PDT

Process-Property Interactions for Additive Sustainable-Ink Circuits with Component Attachment

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Auburn University

All-In PassStudent Explorer Pass

10:50 AM – 11:10 AM PDT

Design and Testing of Encapsulated RF Structures for Flexible and Hybrid Electronic Applications

Location: Moscone South, Exhibition Level, Room 11

Speaker: – NextFlex

All-In PassStudent Explorer Pass

11:10 AM – 11:30 AM PDT

A Disruptive Dry Multimaterial Printer for Electronics, Sensors, and Functional Devices

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Auburn University/NanoPrintek, Inc.

All-In PassStudent Explorer Pass

11:30 AM – 11:50 AM PDT

Reliability of Copper based Printed Electronic Flexible Circuits

Location: Moscone South, Exhibition Level, Room 11

Speaker: – MiQro Innovation Collaborative Center (C2MI)

All-In PassStudent Explorer Pass

11:50 AM – 12:10 PM PDT

From One to Many: Challenges to Printed Electronics Reliability at Scale

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Bayflex Solutions

All-In PassStudent Explorer Pass

10:30 AM – 12:35 PM PDT

Connecting the Automotive Ecosystem With SiC Manufacturing

Location: Moscone North, Exhibition Level, Room 21

All-In PassStudent Explorer Pass

10:30 AM – 10:32 AM PDT

Welcome Remarks

Location: Moscone North, Exhibition Level, Room 21

Session Moderator: – SEMI

All-In PassStudent Explorer Pass

10:32 AM – 10:35 AM PDT

Welcome Remarks

Location: Moscone North, Exhibition Level, Room 21

Session Moderator: – Entegris Inc.

All-In PassStudent Explorer Pass

10:35 AM – 10:50 AM PDT

Making Hard Things Easier: Applied Materials Solutions for Silicon Carbide

Location: Moscone North, Exhibition Level, Room 21

Speaker: – Applied Materials

All-In PassStudent Explorer Pass

10:50 AM – 11:10 AM PDT

Accelerating SiC Commercialization and Barriers to Overcome

Location: Moscone North, Exhibition Level, Room 21

Speaker: – PowerAmerica

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11:10 AM – 11:30 AM PDT

Breaking down barriers: How closer cooperation along the value chain can help a widespread SiC adoption and ensure a resilient supply.

Location: Moscone North, Exhibition Level, Room 21

Speaker: – Robert Bosch GmbH

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11:30 AM – 11:50 AM PDT

Progress in SiC Manufacturing Boosts Vehicle Electrification

Location: Moscone North, Exhibition Level, Room 21

Speaker: – STMicroelectronics

All-In PassStudent Explorer Pass

11:50 AM – 12:05 PM PDT

Purpose Driven Design: Advancing SiC Technology into the Future!

Location: Moscone North, Exhibition Level, Room 21

Speaker: – Axus Technology

All-In PassStudent Explorer Pass

12:05 PM – 12:20 PM PDT

SmartSiC™: a greener, faster and better technology for SiC

Location: Moscone North, Exhibition Level, Room 21

Speaker: – SOITEC

All-In PassStudent Explorer Pass

12:20 PM – 12:35 PM PDT

Meeting the SiC gold rush with Entegris Capabilities.

Location: Moscone North, Exhibition Level, Room 21

Speaker: – Entegris

Expo Plus PassThought Leadership PassAll-In PassStudent Explorer Pass

10:30 AM – 12:40 PM PDT

Extended Chip Capacity

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Expo PassExpo Plus PassThought Leadership PassAll-In PassStudent Explorer Pass

10:30 AM – 10:35 AM PDT

Welcome Remarks and Session Introduction

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Session Moderator: – Deloitte

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10:35 AM – 10:55 AM PDT

Connecting the Dots: From KPIs to Smart Manufacturing Applications to Industry Standards

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Cimetrix by PDF Solutions

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10:55 AM – 11:15 AM PDT

Maintenance Content Reduction and Digitalization for Performance Optimization

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – INFICON

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11:15 AM – 11:35 AM PDT

Supply Chain Visibility and Resilience: IBM Case-Study

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – IBM Semiconductor

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11:35 AM – 11:55 AM PDT

Accelerating Global Semiconductor Manufacturing

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Tignis

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11:55 AM – 12:15 PM PDT

Scalable Semiconductor Fab Production Scheduling Using Reinforcement Learning and Microsoft Azure

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – minds.ai

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12:15 PM – 12:35 PM PDT

Capacity Planning and Material Flow Optimisation in the Fab – How to Make it Smart(er)

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – D-SIMLAB Technologies Pte Ltd

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12:35 PM – 12:40 PM PDT

Closing Remarks

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Session Moderator: – Deloitte

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10:30 AM – 2:00 PM PDT

Intel Sustainability Summit

Location: Moscone South, Exhibition Level Room 10

Invitation Only

Sponsor

10:30 AM – 3:30 PM PDT

Accelerating The Pace of Lithography And Scaling Innovation

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

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10:30 AM – 10:35 AM PDT

Welcome Remarks and Session Overview

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Session Moderator: – Instant Insight Inc.

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10:35 AM – 10:55 AM PDT

Holistic Patterning to Enable Manufacturing for 2nm and Beyond

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – ASML

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10:55 AM – 11:15 AM PDT

Three Innovations in Ebeam Technology to Accelerate EUV Lithography, Gate-All-Around Transistors and High Aspect Ratio Memories & Interconnects.

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Applied Materials

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11:15 AM – 11:35 AM PDT

Outlook for Advanced Logic Era: Process Innovation to Address Scaling Challenges

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Tokyo Electron America, inc.

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11:35 AM – 11:55 AM PDT

Patterning Challenges in the Era of Vertical Scaling

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – IBM

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11:55 AM – 12:15 PM PDT

The Advent of Quantum Computing: Thanks to CMOS Technologies

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Siquance

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12:15 PM – 12:30 PM PDT

Q&A (Morning Session)

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Session Moderator: – Instant Insight Inc.

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1:30 PM – 1:35 PM PDT

Welcome Remarks (Afternoon Session)

Session Moderator: – Instant Insight Inc.

1:35 PM – 1:55 PM PDT

EUVL Dry Resist for the 1nm Node and Beyond

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Lam Research

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1:55 PM – 2:15 PM PDT

Patterning Challenges and Innovations on the Eve of High NA EUV Lithography

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – imec

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2:15 PM – 2:35 PM PDT

Challenges and Building Blocks for 2030 Scaling and Beyond

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – Intel Corporation

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2:35 PM – 2:55 PM PDT

Enabling Moore's Law Through Heterogeneous Integration

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – AMD

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2:55 PM – 3:15 PM PDT

Challenges & Opportunities For Developing Superconducting Quantum Information Systems

Location: TechTalk Stage, Moscone South, Exhibition Level, Room 4

Speaker: – National Institute of Standards & Technology

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3:15 PM – 3:30 PM PDT

Q&A and Closing Remarks

Session Moderator: – Instant Insight Inc.

10:30 AM – 3:30 PM PDT

Startups for Sustainable Semiconductors

Location: Moscone South, Exhibition Level, Room 2

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Sponsor

10:30 AM – 10:55 AM PDT

Keynote:The Power of Partnership: Accelerating Sustainability Innovation

Location: Moscone South, Exhibition Level, Room 2

Keynote Speaker: – Micron

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10:55 AM – 11:20 AM PDT

Keynote: Sustainable Semiconductor Initiatives - Learning from Abroad

Location: Moscone South, Exhibition Level, Room 2

Keynote Speaker: – TEL Ventures

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11:30 AM – 2:00 PM PDT

Startup Presentations

Location: Moscone South, Exhibition Level, Room 2

Speaker: – Multiscale Technologies

Speaker: – CFEX

Speaker: – GRAPHEC

Speaker: – Aqua Membranes

Speaker: – ElectraMet

Speaker: – Innoflex

Speaker: – L2X Labs

Speaker: – Purity Resource

Speaker: – Corintis

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2:00 PM – 3:00 PM PDT

Panel: Role of CVC's in Sparking Sustainability Innovations

Location: Moscone South, Exhibition Level, Room 2

Panel Session Moderator: – M Ventures

Panelist: – Intel Capital

Panelist: – Lam Research

Panelist: – SK Hynix

Panelist: – TEL

Panelist: – Enterprise Singapore

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10:30 AM – 4:00 PM PDT

Building an Inclusive Talent Pipeline

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

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10:30 AM – 11:25 AM PDT

Upskilling the Microelectronics Workforce Via Non-traditional Pathways

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Panel Session Moderator (WFD Session): – MACNY – The Manufacturers Association

Panelist (WFD Session): – Mohawk Valley Community College (NY)

Panelist (WFD Session): – State University of New York

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11:30 AM – 11:55 AM PDT

Workforce Development Initiatives through Collaborative Efforts

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – Cornell Nanoscale Science & Technology Facility

Speaker (WFD Pavilion): – Tompkins Cortland Community College

Speaker (WFD Pavilion): – Odyssey Semiconductor

Speaker (WFD Pavilion): – Tompkins Cortland Community College

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12:00 PM – 12:25 PM PDT

Purdue University Pilot Workforce Development Programs for the Semiconductor Industry

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

Speaker (WFD Pavilion): – Purdue University

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1:00 PM – 4:00 PM PDT

HTU 2.0

Location: Workforce Development Theater, Moscone North, Exhibition Level, Hall F

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11:00 AM – 1:00 PM PDT

Joint 3DP&I Bonded Wafer Stacks and 3DP&I Inspection & Metrology Task Force Meeting

Location: Moscone South, Level 3

Standards

11:30 AM – 2:30 PM PDT

Food Trucks Open

Location: Moscone North, Hall F

11:30 AM – 2:30 PM PDT

Taste of San Francisco Lunch: Fisherman's Wharf Day

Location: Moscone South, Expo Hall

All-In Pass

1:00 PM – 2:30 PM PDT

3D Packaging & Integration (3DP&I) North America Technical Committee Chapter Meeting

Location: Moscone South, Level 3

Standards

1:00 PM – 2:55 PM PDT

FLEXTalks

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

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1:00 PM – 1:10 PM PDT

New Perspectives to Improve Reliability for Printed Electronics

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Bayflex Solutions

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1:15 PM – 1:25 PM PDT

Material and Coating Innovation at Argonne National Laboratory

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Argonne National Laboratory

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1:30 PM – 1:40 PM PDT

Wafer Metallization with Additive, Metal Complex Inks

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Electroninks Inc.

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1:45 PM – 1:55 PM PDT

Unlocking the Future of Printed Electronics

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – Voltera

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2:00 PM – 2:10 PM PDT

Flat Panel Semiconductor Manufacturing

Location: FLEXTalks Meet the Experts Theater, Moscone South, Exhibition Level, Hall C

Speaker: – InnovaFlex Foundry

1:00 PM – 3:00 PM PDT

IRAM – Industry4 Readiness Assessment Workshop:A tool to Guide and Measure progress of your Smart Manufacturing Journey

Location: Moscone South, Room 154, Mezzanine Level

Invitation Only

1:30 PM – 2:50 PM PDT

FLEX Conference: Hybrid Electronics & Advanced Packaging

Location: Moscone South, Exhibition Level, Room 11

Session Chair: – PICadvanced

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1:30 PM – 1:50 PM PDT

Die-to-Wafer Hybrid Bonding to address Next-Gen Electronics Packaging Challenges

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Applied Materials

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1:50 PM – 2:10 PM PDT

Stretchable Thermoelectric Generators and Peltier Coolers for Wearable Applications

Location: Moscone South, Exhibition Level, Room 11

Speaker: – Carnegie Mellon University

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2:10 PM – 2:30 PM PDT

Ultra-thin Chiplet Integration for small-scale flexible Devices by Micro-Transfer Printing

Location: Moscone South, Exhibition Level, Room 11

Speaker: – X-FAB MEMS Foundry

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2:30 PM – 2:50 PM PDT

Advanced Hybrid Printing Processes for Complex Metal Dielectric Structures via Three-Axis Systems

Location: Moscone South, Exhibition Level, Room 11

Speaker: – The University of Texas at El Paso

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1:30 PM – 2:50 PM PDT

FLEX Conference: Processing & Integration

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Session Chair: – Kent Displays

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1:30 PM – 1:50 PM PDT

Highly Conductive Transparent Electrodes Based on Embedded Metal-mesh and Applications

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Jiangsu Industrial Technology Research Institute

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1:50 PM – 2:10 PM PDT

Modular microcontrollers for rapidly configurable IOT devices

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – NextFlex

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2:10 PM – 2:30 PM PDT

Non-contact Capacitive Coupling-based EMG Sensing System for Smart Armband Applications

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Industrial Technology Research Institute

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2:30 PM – 2:50 PM PDT

Flexible Hybrid Electronics Sensors for Product Quality Monitoring and Logistics Applications

Location: Flex Conference, Moscone South, Exhibition Level, Room 8

Speaker: – Yamagata University

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1:30 PM – 3:30 PM PDT

International Standards Committee (ISC) Meeting (By Invitation Only)

Location: Moscone South, Level 3

Standards

1:30 PM – 3:40 PM PDT

Foundations to Build Agile Supply Chains

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

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1:30 PM – 1:35 PM PDT

Welcome Remarks and Session Introduction

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Session Moderator: – SEMI

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1:35 PM – 1:55 PM PDT

Multi-tier Supplier Network Operations Visibility

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Deloitte Consulting

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1:55 PM – 2:15 PM PDT

Health of the Semiconductor Supply Chain: An Inside Look

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – McKinsey & Company

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2:15 PM – 2:35 PM PDT

Cutting-Edge Technology Deserves Cutting-Edge Supply Chain Management

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – IBM

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2:35 PM – 2:55 PM PDT

The State of Michigan and New Models of Supply Chain Agility, Collaboration and Innovation

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Michigan Economic Development Corporation (MEDC)

Speaker: – Michigan Economic Development Corporation

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2:55 PM – 3:15 PM PDT

How To Prepare for Unprecedented Growth and Risk in the Semiconductor Industry

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Presenter: – Genpact

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3:15 PM – 3:35 PM PDT

Supply Chain Management for the Semiconductor Fab of the Future

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Speaker: – Joun Technologies

Speaker: – Kearney

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3:35 PM – 3:40 PM PDT

Closing Remarks

Location: Smart Manufacturing Meet the Experts Theater, Smart Manufacturing Pavilion, Moscone North, Exhibition Level, Hall F

Session Moderator: – SEMI

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2:30 PM – 3:30 PM PDT

Student Explorer Experience: Guided Tour of SEMICON West

Location: Workforce Development Pavilion, Moscone North, Exhibition Level, Hall F

Student Explorer Pass

9:00 AM – 11:00 AM PDT

NextFlex Technology Hub Tour

All-In Pass

FLEX Conference: Student Poster Session

Location: Moscone South, Exhibition Level, Room 12

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A flexible 3D FOWLP integration with a flexible “battlet” battery and a wireless charger

Location: Moscone South, Exhibition Level, Room 12

Speaker: – UCLA

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A High Flexibility. High Resolution, Heterogeneously Integrated Flexible MicroLED Display Enabled by FlexTrateTM

Location: Moscone South, Exhibition Level, Room 12

Speaker: – UCLA

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Additive Manufacturing of Flexible Rectenna

Location: Moscone South, Exhibition Level, Room 12

Speaker: – University of Washington

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Aerosol jet printing of high aspect ratio and high surface area graphene microstructures

Location: Moscone South, Exhibition Level, Room 12

Speaker: – Iowa State University

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All-Solution Processed Silver Nanowire/Carbon Black Strain Sensor Array for Human Motion Detection

Location: Moscone South, Exhibition Level, Room 12

Speaker: – Department of Electrical and Computer Engineering, Seoul National University

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Composition-Tunable Properties of CuAg Alloy for Hybrid Bonding Applications

Location: Moscone South, Exhibition Level, Room 12

Speaker: – SUNY Polytechnic Institute

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Effect of Flexion on Performance of a High Bandwidth Flexible Connector with Low-Loss Dielectric

Location: Moscone South, Exhibition Level, Room 12

Speaker: – University of California, Los Angeles

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Fabrication of Anti-Moiré Filters Using Slot-Die Coating

Location: Moscone South, Exhibition Level, Room 12

Speaker: – Korea University of Technology and Education

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Fabrication of spherical microlens array using needle coating for light extraction of OLEDs

Location: Moscone South, Exhibition Level, Room 12

Speaker: – Korea University of Technology and Education

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High-Temperature Microsupercapacitor Arrays Enabled by Printable Ionogel Electrolytes

Location: Moscone South, Exhibition Level, Room 12

Speaker: – Northwestern University

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Human motion detection utilizing strain and electromyography signals attached to a non-joint area

Location: Moscone South, Exhibition Level, Room 12

Speaker: – Seoul National University

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Increased adhesion of plasma-printed and self-sintered gold for low-temperature flexible electronics

Location: Moscone South, Exhibition Level, Room 12

Speaker: – Oregon State Univeristy

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sEMG-Strain Integrated Patch for Monitoring Muscle Hyperextension during Exercise and Rehabilitation

Location: Moscone South, Exhibition Level, Room 12

Speaker: – Seoul National University

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Strain-insensitive Pressure Sensor Array based on a Strain-engineering Rigid Island Array

Location: Moscone South, Exhibition Level, Room 12

Speaker: – Electrical and Computer Engineering, Seoul National University

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Textile EMG Sensors for Bluetooth Electromyography-based Stroke Therapeutic (BEST) system

Location: Moscone South, Exhibition Level, Room 12

Speaker: – North Carolina State University

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